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US 7,023,076 B2Granted
Multiple chip semiconductor packages
AssigneeUnited Test and Assembly Center Ltd.
InventorWang Chuen Khiang
Life of this patent
Estimating the term…
Abstract
A semiconductor package, containing two or more IC devices. The IC devices are oriented in the same manner and at least two IC devices are separated by a die paddle that is attached to the active face of one of the IC devices, inward of the electrical contact areas.
Claims26
A semiconductor package, comprising:
- a first IC device with a plurality of electrical connection areas on a periphery of an active face;
- a die paddle, directly attached to the active face of the first IC device, inward of the electrical connection areas, the die paddle being sized such that it does not cover the plurality of electrical connection areas of the first IC device;
- a second IC device, a passive face of the second IC device being directly attached to the die paddle, and having a plurality of electrical connection areas on an active face opposite the passive face;
- and
- electrical connections between the plurality of electrical connection areas of the first and second IC devices and a plurality of external electrical terminals that protrude from the package, an end portion of at least one of the plurality of external electrical terminals being bent down such that the end portion is approximately level with the active face of the first IC device;
- wherein the first and second IC devices, the die paddle, the electrical connections, and a portion of each of the plurality of external electrical terminals are enclosed by an encapsulation.
3 more elements
A method of assembling a semiconductor packages comprising:
- directly attaching a die paddle to an active face of a first IC device, inward of a plurality of electrical connection areas on a periphery of the active face of said first IC device;
- forming electrical connections between said plurality of electrical connection areas on the first IC device and a plurality of external electrical terminals;
- directly attaching a passive face of a second IC device to the die paddle;
- forming electrical connections between the plurality of electrical contact areas on an active face of the second IC device and the plurality of external electrical terminals;
- and
- enclosing the first and second IC devices, the die paddle, the electrical connections, and a portion of each of the plurality of external electrical terminals in an encapsulation,
- bending down an end portion of at least one of the plurality of external electrical terminals such that the end portion is approximately level with the active face of the first IC device.
4 more elements
Dependencies are inferred from the claim text.