Silicon microphone
AssigneeKnowles Electronics, LLC
InventorsSung Bok Lee, Peter V. Loeppert
Life of this patent
Estimating the term…
Abstract
A solid-state transducer is disclosed. The transducer comprises a semi-conductor substrate forming a support structure and having an opening. A thin-film structure forming a diaphragm responsive to fluid-transmitted acoustic pressure is disposed over the opening. The transducer further includes a plurality of semi-conductor supports and tangential arms extending from the diaphragm edge for connecting the periphery of the diaphragm to the supports. The tangential arms permit the diaphragm to rotate relative to the supports to relieve film stress in the diaphragm. The transducer still further includes a plurality of stop bumps disposed between the substrate and the diaphragm. The stop bumps determine the separation of the diaphragm from the substrate when the transducer is biased.
Claims33
A solid-state transducer comprising:
- a substrate forming a support structure and having an opening;
- a thin-film structure forming a diaphragm responsive to fluid-transmitted acoustic pressure and disposed over the opening;
- a plurality of supports;
- means for connecting the periphery of the diaphragm to the supports, wherein the connecting means strains to permit the diaphragm to move relative to the supports to relieve film stress in the diaphragm;
- and
- a plurality of stop bumps disposed between the substrate and the diaphragm, the stop bumps determining the separation of the diaphragm from the substrate when the transducer is biased.
A solid-state transducer comprising:
- a semi-conductor substrate forming a support structure and having an opening;
- a thin-film structure forming a diaphragm responsive to fluid-transmitted acoustic pressure and disposed over the opening, the diaphragm including a plurality of tangentially extending arms;
- a plurality of semi-conductor supports coupling each of the arms to the substrate;
- and
- a plurality of stop bumps disposed between the substrate and the diaphragm, the stop bumps determining the separation of the diaphragm from the substrate when the transducer is biased.
A solid-state transducer comprising:
- a semi-conductor substrate forming a support structure and having an opening;
- a thin-film structure forming a diaphragm responsive to fluid-transmitted acoustic pressure and disposed over the opening;
- a plurality of semiconductor supports;
- and
- means for connecting the periphery of the diaphragm to the supports, wherein the connecting means strains to relieve film stress in the diaphragm.
Dependencies are inferred from the claim text.