Back to results
US 7,023,023 B2Granted
Optical interconnects in integrated circuits
AssigneeIntel Corporation
InventorsTanay Karnik, Jianping Xu
Life of this patent
Estimating the term…
Abstract
An integrated circuit die includes optical interconnect ports on a first side and electrical interconnect ports on a second side.
Claims16
An apparatus comprising:
- a package having optical apertures;
- and
- an integrated circuit die mounted to the package, the integrated circuit die having a backside with optical interconnect ports, and a front side with active circuitry and electrical interconnect ports, and wherein the integrated circuit die includes vertical cavity lasers on the back side to emit laser light through the optical interconnect ports and optical apertures.
An integrated circuit die comprising:
- a silicon substrate having a front side and a back side;
- at least one active circuit residing on the front side;
- a plurality of electrical interconnects on the front side;
- and
- a plurality of vertical cavity lasers in the silicon substrate, wherein the plurality of vertical cavity lasers are manufactured on the back side of the silicon substrate to emit laser light from the back side.
2 more elements
A packaged integrated circuit comprising:
- an integrated circuit die having a first side and a second side substantially parallel to the first side, wherein the integrated circuit die includes active circuitry on the first side, electrical interconnects on the first side, and vertical cavity lasers manufactured on the second side to emit laser light from the second side;
- and
- a package to accept the integrated circuit die in a flip-chip application, the package including electrical interconnects to electrically coupled to the electrical interconnects of the integrated circuit die, and wherein the package has at least one aperture through which the laser light can pass.
Dependencies are inferred from the claim text.