Surface treating device and surface treating method
AssigneeTokyo Electron Limited
InventorsKazuya Nagaseki, Tadashi Onishi, Koichi Murakami, Daisuke Hayashi, Akiko Kamigori, Minoru Honda
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Abstract
Installed in a vacuum chamber is a mounting table for supporting semiconductor wafer, which is a substrate to be treated, with an electron beam irradiation mechanism mounted on the ceiling of the vacuum chamber for generating electron beams. The mounting table is adapted to be vertically moved by a lifting/lowering device, allowing the distance between the electron beam irradiating mechanism and the semiconductor wafer to be set at a desired value. This makes it possible to perform a uniform satisfactory treatment over the entire surface of the substrate to be treated.
Claims17
A surface treating device, comprising:
- a vacuum chamber to be set at a specific vacuum atmosphere therein;
- a mounting table installed in the vacuum chamber, on which a substrate to be treated is mounted;
- an electron beam irradiation mechanism for irradiating electrons to the substrate to be treated;
- and
- an electron path control unit for controlling a path of the electrons irradiated from the electron beam irradiation mechanism.
A surface treating device, comprising:
- a vacuum chamber to be set at a specific vacuum atmosphere therein;
- a mounting table installed in the vacuum chamber, on which a substrate to be treated is mounted;
- an electron beam irradiation mechanism for irradiating electrons to the substrate to be treated;
- and
- an electron path control unit for controlling a path of the electrons irradiated from the electron beam irradiation mechanism,
- wherein the electron path control unit includes an electron path deflecting member and controls the path of the electrons by a potential of the electron path deflecting member.
A surface treating device, comprising:
- a vacuum chamber to be set at a specific vacuum atmosphere therein;
- a mounting table installed in the vacuum chamber, on which a substrate to be treated is mounted;
- an electron beam irradiation mechanism for irradiating electrons to the substrate to be treated;
- and
- an energy control mechanism for irradiating the electrons to the substrate to be treated by controlling energies of electrons irradiated from the electron beam irradiation mechanism,
- wherein the energy control mechanism functions to filter electron energies such that electrons of other than predetermined energies are removed from electrons emitted from the electron beam irradiation mechanism.
A surface treating device, comprising:
- a vacuum chamber to be set at a specific vacuum atmosphere therein;
- a mounting table installed in the vacuum chamber, on which a substrate to be treated is mounted;
- an electron beam irradiation mechanism for irradiating electrons to the substrate to be treated;
- and
- an energy control mechanism for irradiating the electrons to the substrate to be treated by controlling energies of electrons irradiated from the electron beam irradiation mechanism,
- wherein the energy control mechanism includes an electrode installed in the mounting table.
A surface treating device, comprising:
- a vacuum chamber to be set at a specific vacuum atmosphere therein;
- a mounting table installed in the vacuum chamber, on which a substrate to be treated is mounted;
- an electron beam irradiation mechanism for irradiating electrons to the substrate to be treated;
- and
- an energy control mechanism for irradiating the electrons to the substrate to be treated by controlling energies of electrons irradiated from the electron beam irradiation mechanism,
- wherein the energy control mechanism includes a meshed or perforated middle electrode installed between the mounting table and the electron beam irradiation mechanism.
Dependencies are inferred from the claim text.