Method and apparatus for measuring physical properties of micro region
AssigneeHitachi, Ltd.
InventorsYoshifumi Taniguchi, Mikio Ichihashi, Masanari Kouguchi
Life of this patent
Estimating the term…
Loading patent…
AssigneeHitachi, Ltd.
InventorsYoshifumi Taniguchi, Mikio Ichihashi, Masanari Kouguchi
Estimating the term…
A method and apparatus for measuring the physical properties of a micro region measures the two-dimensional distribution of stress/strain in real time at high resolution and sensitivity and with a high level of measuring position matching. A sample is scanned and irradiated with a finely focused electron beam (23, 26), and the displacement of position of a diffraction spot (32, 33) is measured by a two-dimensional position-sensitive electron detector (13). The displacement amount is outputted as a voltage value that is then converted into the magnitude of the stress/strain according to the principle of a nano diffraction method, and the magnitude is displayed in synchronism with a sample position signal.
A method of measuring the physical properties of a micro region, comprising the steps of:
An apparatus for measuring the physical properties of a micro region, the apparatus comprising:
Dependencies are inferred from the claim text.