One-pack moisture-curing epoxy resin composition
AssigneeKonishi Co., Ltd.
InventorsTakeshi Endo, Fumio Sanda, Hisakazu Horii, Kentaro Suzuki, Nobuki Matsuura
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AssigneeKonishi Co., Ltd.
InventorsTakeshi Endo, Fumio Sanda, Hisakazu Horii, Kentaro Suzuki, Nobuki Matsuura
Estimating the term…
A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition includes one ore more members selected from the group consisting of vinyl carboxylates of the general formula (1) and epoxy-containing silyl compounds of the general formula (2), one or more members selected from the group consisting of ketimines and oxazolidines, and an epoxy resin. (1) [In the general formula (1), R1, R2, R3, and R4 are each independently hydrogen or an organic group; and n is an integer of 1 or above] (2) [In the general formula (2), R5 and R6 are each independently alkyl; R7 is an epoxy-containing organic group; and n is an integer of 1 to 3]
A one-pack moisture curable epoxy resin composition comprising:
Dependencies are inferred from the claim text.