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AssigneeKoninklijke Philips Electronics N.V.
InventorsJohan Bosman, Peter Wilhelmus Maria Van De Water, Roelf Anco Jacob Groenhuis
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The invention relates to a method of manufacturing an electronic component (1), in particular a semiconductor component (1), which is provided with electric connection regions (2), wherein a mark (M), such as a type number, is provided on a surface thereof by means of laser radiation (3). In a method according to the invention, the component (1) is attached with one (4) of its sides (4, 7) to a foil (5) by means of an adhesive layer (6), and the component is provided, on said side (4), with the mark (M) through the foil (5) and the adhesive layer (6). In this manner, a large number of components (1) can be readily provided with a mark (M) without undue handling, and the marking operation can be readily integrated in the complete manufacturing process of the components. Surprisingly it has been found that marking through a radiation-absorbing double layer (5, 6) is very well feasible. The component (1) can be attached to the foil (6) without contact between the electric connection region (2) and the adhesive layer. Preferably, a large number of components (1) are manufactured simultaneously and within a single body (10) that is attached to the foil (5). After the provision of the mark (M), the components (1) are separated from each other.
A method of manufacturing an electronic component that is provided with electric connection regions wherein a mark is provided on a surface of the electronic component by means of laser radiation, a part of the surface of the component being exposed to the laser radiation, causing it to be modified in such a manner that the irradiated visually contrasts with the rest of the surface and forms the mark, characterized in that the electronic component is attached with one side to a foil by means of an adhesive layer, and the component is provided, on this side, with the mark through the foil and the adhesive layer, wherein a number of components within a body are jointly manufactured so as to be interconnected and are attached to the foil, after which they are individualized following the provision of the mark.
Dependencies are inferred from the claim text.