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US 7,022,556 B1Granted
Exposure device, exposure method and method of manufacturing semiconductor device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorHiroki Adachi
Life of this patent
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Abstract
The present invention provides a highly controllable device for exposure from the back side and an exposure method, and also provides a method of manufacturing a semiconductor device using the same. The present invention involves exposure with the use of the back side exposure device of which a reflecting means is disposed on the front side of a substrate, apart from a photosensitive thin film surface by a distance X(X=0.1 μm to 1000 μm), and formation of a photosensitive thin film pattern in a self alignment manner, with good controllability, at a position a distance Y away from the end of a pattern. The invention fabricates a TFT using that method.
Claims29
A method of manufacturing a semiconductor device comprising steps of:
- forming a gate electrode over a front side of a substrate;
- forming a semiconductor film over said gate electrode with a gate insulating film interposed therebetween;
- forming a photosensitive film over said semiconductor film;
- providing a reflecting plate apart from a surface of said photosensitive film by a predetermined distance;
- providing a light source for emitting a light adjacent to a back side of said substrate;
- and
- exposing said photosensitive film by irradiating from the back side of said substrate with said light emitted from said light source using said gate electrode as a mask and said reflecting plate for reflecting said light having penetrated through said photosensitive film thereby said photosensitive film is irradiated from said front side of said substrate with the light.
4 more elements
A method of manufacturing a semiconductor device, comprising steps of:
- forming a pattern comprising a light-shielding film over a front side of a light transmissive substrate;
- forming a photosensitive film over said pattern;
- providing a light source for emitting a light adjacent to a back side of said light transmissive substrate;
- reflecting or scattering by a reflecting means the light from the light source which has penetrated through said photosensitive film, and thereby irradiating said photosensitive film with the light from the front side of said light transmissive substrate to expose the photosensitive film;
- and
- developing the photosensitive film.
3 more elements
A method of manufacturing a semiconductor device, comprising steps of:
- forming a pattern comprising a light-shielding film over a front side of a light transmissive substrate;
- forming a photosensitive film over said pattern;
- providing a light source for emitting a light adjacent to a back side of said light transmissive substrate;
- exposing said photosensitive film by irradiating from the back side of said light transmissive substrate with the light emitted from the light source, while using said pattern as a mask;
- reflecting or scattering by a reflecting means the light from the light source which has penetrated through said photosensitive film, so that said photosensitive film is irradiated from the front side of said light transmissive substrate with the light and is exposed;
- and
- developing the photosensitive film.
4 more elements
A method of manufacturing a semiconductor device, comprising steps of:
- forming a gate wiring over a front side of a light transmissive substrate;
- forming a gate insulating film on said gate wiring;
- forming a semiconductor film on said gate insulating film;
- forming a photosensitive film over said semiconductor film;
- providing a light source for emitting a light adjacent to a back side of said light transmissive substrate:
- exposing said photosensitive film by irradiating from the back side of said light transmissive substrate with the light emitted from a light source while using said gate wiring as a first mask;
- and
- reflecting or scattering by a reflecting means the light from the light source, which has penetrated through said photosensitive film, so that said photosensitive film is irradiated from the front side of said light transmissive substrate with the light and is exposed;
- removing an exposed part of the photosensitive film to form a pattern comprising the photosensitive film;
- and
- doping said semiconductor film with dopants for imparting conductivity using said pattern comprising the photosensitive film as a second mask.
8 more elements
A method of manufacturing a semiconductor device, comprising steps of:
- forming a gate wiring over a front side of a light transmissive substrate;
- forming a gate insulating film on said gate wiring;
- forming a semiconductor film on said gate insulating film;
- forming an insulating film on said semiconductor film;
- forming a photosensitive film on said insulating film;
- providing a light source for emitting a light adjacent to a back side of said light transmissive substrate;
- exposing said photosensitive film by irradiating from the back side of said light transmissive substrate with the light emitted from the light source while using said gate wiring as a first mask;
- reflecting or scattering by a reflecting means the light from the light source which has penetrated through said photosensitive film, so that said photosensitive film is irradiated from the front side of said light transmissive substrate with the light and is exposed;
- removing an exposed part of the photosensitive film to form a first pattern comprising the photosensitive film;
- selectively removing said insulating film using said first pattern as a second mask to form a second pattern comprising said insulating film;
- removing said first pattern comprising the photosensitive film;
- and
- doping said semiconductor film with dopants for imparting a conductivity using said second pattern comprising the insulating film as a third mask.
10 more elements
A method of manufacturing a semiconductor device, comprising steps of:
- forming a gate wiring over a front side of a light transmissive substrate;
- forming a gate insulating film on said gate wiring;
- forming a semiconductor film on said gate insulating film;
- forming an insulating film on said semiconductor film;
- forming a photosensitive film on said insulating film;
- providing a light source for emitting a light adjacent to a back side of said light transmissive substrate;
- exposing said photosensitive film by irradiating from the back side of said light transmissive substrate with the light emitted from the light source while using said gate wiring as a first mask;
- reflecting or scattering by a reflecting means the light from the light source which has penetrated through said photosensitive film, so that said photosensitive film is irradiated from the front side of said light transmissive substrate with the light and is exposed;
- removing an exposed part of the photosensitive film to form a first pattern comprising the photosensitive film;
- selectively removing said insulating film using said first pattern as a second mask to form a second pattern comprising said insulating film;
- removing said first pattern comprising the photosensitive film;
- and
- doping said semiconductor film with dopants for imparting a conductivity using said second pattern comprising the insulating film as a third mask.
10 more elements
A method of manufacturing a semiconductor device, comprising steps of:
- forming a gate wiring over a front side of a light transmissive substrate;
- forming a gate insulating film on said gate wiring;
- forming a semiconductor film on said gate insulating film;
- forming an insulating film on said semiconductor film;
- forming a first photosensitive film on said insulating film;
- providing a light source for emitting lights adjacent to a back side of said light transmissive substrate;
- exposing said first photosensitive film by irradiating from the back side of said light transmissive substrate with a first light emitted from the light source while using said gate wiring as a first mask;
- reflecting or scattering by a first reflecting means the first light from the light source which has penetrated through said first photosensitive film, so that said first photosensitive film is irradiated with the first light from the front side of said light transmissive substrate and is exposed;
- removing an exposed part the first photosensitive film to form a first pattern comprising the first photosensitive film;
- selectively removing said insulating film while using said first pattern as a second mask to form a second pattern comprising the insulating film;
- removing said first pattern comprising said first photosensitive film;
- forming a second photosensitive film;
- exposing said second photosensitive film by irradiating from the back side of said light transmissive substrate with a second light emitted from the light source while using said gate wiring as a third mask;
- reflecting or scattering by a second reflecting means the second light from the light source which has penetrated through said second photosensitive film, so that said second photosensitive film is irradiated with the second light from the front side of said light transmissive substrate and is exposed;
- removing an exposed part of the second photosensitive film to form a third pattern comprising the second photosensitive film;
- doping with a high concentration of dopants for imparting conductivity while using said second pattern and said third pattern as masks;
- removing said third pattern;
- and
- doping a low concentration of dopants for imparting conductivity while using said second pattern as a fourth mask.
16 more elements
A method of manufacturing a semiconductor device, comprising steps of:
- forming a pattern comprising a light-shielding film over a front side of a light transmissive substrate;
- forming a photosensitive film over said pattern;
- providing a reflecting means over the front side of said light transmissive substrate;
- providing a light source for emitting a light adjacent to the back side of said light transmissive substrate;
- and
- exposing said photosensitive film by irradiating from the back side of said light transmissive substrate with said light emitted from said light source while using said pattern as a mask,
- wherein said reflecting means reflects said light passing through said photosensitive film, thereby said photosensitive film is irradiated from the front side of said light transmissive substrate with the light and is exposed.
4 more elements
A method of manufacturing a semiconductor device, comprising steps of:
- forming a pattern comprising a light-shielding film over a front side of a light transmissive substrate;
- forming a photosensitive film over said pattern;
- providing a light source for emitting a light adjacent to the back side of said light transmissive substrate;
- exposing said photosensitive film by irradiating from the back side of said light transmissive substrate with the light emitted from the light source while using said pattern as a mask;
- and
- reflecting or scattering by a reflecting means the light from the light source which has penetrated through said photosensitive film, so that said photosensitive film is irradiated from the front side of said light transmissive substrate with the light and is exposed.
3 more elements
Dependencies are inferred from the claim text.