Method for fabricating circuit module
AssigneeMurata Manufacturing Co., Ltd.
InventorsKazuo Kasue, Takehisa Kajikawa, Satoru Hachinohe
Life of this patent
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Abstract
A method for fabricating a circuit module includes a step of filling the gap between a chip component and a substrate on which the chip component is mounted in a flip chip configuration with resin. The method uses simplified equipment and minimizes the undesired spread of resin. The resin is supplied between the sidewall of a dispenser needle and the sidewall of the chip component. Due to capillary action, a resin pool is formed and then the gap between the chip component and the substrate is spontaneously filled with the resin of the resin pool.
Claims20
A method for fabricating a circuit module comprising the steps of:
- supplying a resin from a dispenser needle disposed at a supplying position onto a substrate on which a chip component is mounted in a flip chip configuration so as to form a resin pool between a sidewall of the chip component and a sidewall of the dispenser needle;
- and
- filling substantially an entire gap between the chip component and the substrate with the resin of the resin pool while the dispenser needle is disposed at the supplying position.
A method for fabricating a circuit module comprising the steps of:
- placing a substrate on a pedestal having a built-in heat source to heat the substrate, the substrate including a chip component that is mounted thereon in a flip chip configuration;
- supplying a resin onto the substrate by a dispenser needle disposed at a supplying position to form a resin pool between a sidewall of the chip component and a sidewall of the dispenser needle;
- and
- filling substantially an entire gap between the chip component and the substrate with the resin of the resin pool while the dispenser needle is disposed at the supplying position.
Dependencies are inferred from the claim text.