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US 7,022,552 B2Granted
Semiconductor device and method for fabricating semiconductor device
AssigneeOki Electric Industry Co., Ltd.
InventorTadashi Yamaguchi
Life of this patent
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Abstract
A semiconductor device includes a semiconductor chip having an electrode pad electrically connected to an integrated circuit and a conducting part electrically connected to the electrode pad; an insulating material formed on a side of the semiconductor chip; and a conductive pattern to extend from a top of a front side of the insulating material to the conducting part of the semiconductor chip.
Claims10
A method for manufacturing a semiconductor device comprising;
- preparing a plurality of semiconductor chips each including an electrode pad electrically connected to an integrated circuit and a conducting part electrically connected to the electrode pad, wherein the electrode pad and the conducting part are formed on a front side of each of the semiconductor chips;
- arranging the semiconductor chips so as to dispose a clearance between the plurality of the semiconductor chips at predetermined intervals;
- filling an insulating material on the front side of each of the semiconductor chips and in the clearance between the semiconductor chips so as to expose a part of the conducting part;
- forming a through hole in the insulating material at a position of the clearance;
- forming a conductive pattern to extend from an inner wall of the through hole to the conducting part of the semiconductor chip;
- and
- cutting the insulating material along the through hole and separating the plurality of the semiconductor chips into individual pieces.
4 more elements
Dependencies are inferred from the claim text.