Capacitive pick-off and electrostatic rebalance accelerometer having equalized gas damping

A method for forming a capacitive pick-off acceleration-sensing device, the method comprising:

• forming an elongated sensing element of substantially uniform thickness suspended for motion relative to a rotational axis offset between first and second ends thereof such that a first portion of the sensing element between the rotational axis and the first end is longer than a shorter second portion between the rotational axis and the second end;
• forming a stationary substrate surface spaced away from the sensing element;
• forming a capacitor between the stationary substrate surface and each of the first and second portions of the sensing element;
• and
• forming a valley in the stationary substrate surface opposite from the first longer portion of the sensing element and spaced away from the rotational axis a distance substantially the same as the distance between the rotational axis and the second end of the sensing element.

A method for forming a capacitive pick-off acceleration-sensing device, the method comprising:

• in a silicon substrate having a substantially planar surface, etching a pendulous sensing element of substantially constant cross-section to be suspended in close proximity to the substrate surface for motion relative to a rotational axis that is offset between a longer and a shorter portion of the pendulous sensing element with the longer and shorter portions of the pendulous sensing element being structured forming different capacitors with respective first and second corresponding opposing portions of the substrate surface, the longer portion of the pendulous sensing element including a distal extended portion that is spaced away from the rotational axis at a distance that is substantially the same as the a length of the shorter portion measured between the rotational axis and a distal end thereof;
• between respective the longer and shorter portions of the pendulous sensing element and the respective first and second corresponding opposing portions of the substrate surface, etching first and second gaps each structured for gas damping;
• and
• between the distal extended portion of the longer portion of the pendulous sensing element and an opposing third portion of the substrate surface corresponding thereto, etching a third gap structured for gas damping.