Back to results
US 7,022,542 B2Granted
Manufacturing method of a microelectromechanical switch
AssigneeSTMicroelectronics S.r.l.
InventorsChantal Combi, Benedetto Vigna
Life of this patent
Estimating the term…
Abstract
The method for manufacturing a micromechanical switch includes manufacturing a hanging bar, on a first semiconductor substrate, equipped at an end thereof with a contact electrode, and a frame projecting from the first semiconductor substrate. A second semiconductor substrate with conductive tracks includes a second input/output electrode and a third starting electrode, and first and second spacers electrically connected to the conductive tracks. The frame is abutted with the first spacers so that the fourth contact electrode abuts on the second input/output electrode in response to an electrical signal provided to the hanging bar by the third starting electrode.
Claims10
A method of manufacturing a micromechanical switch comprising:
- providing a bar overhanging a first semiconductor substrate and including a first contact electrode at an end thereof;
- providing a first frame projecting from the first semiconductor substrate;
- providing a second semiconductor substrate with conductive tracks, a second input/output electrode, a third starting electrode and first peripheral spacers defining a second frame projecting from the second semiconductor substrate and electrically connected to the conductive tracks;
- adjoining the first frame against the first peripheral spacers to define a chamber incorporating the bar therein with the first contact electrode in alignment with the second input/output electrode;
- providing the second semiconductor substrate with a second insulated central spacer;
- and
- adjoining the second insulated central spacer against the bar.
4 more elements
A method of manufacturing a micromechanical switch comprising:
- providing a bar overhanging a first semiconductor substrate and including a first contact electrode at an end thereof;
- providing a first frame projecting from the first semiconductor substrate;
- providing a second semiconductor substrate with conductive tracks, a second input/output electrode, a third starting electrode and first peripheral spacers defining a second frame projecting from the second semiconductor substrate and electrically connected to the conductive tracks;
- adjoining the first frame against the first peripheral spacers to define a chamber incorporating the bar therein with the first contact electrode in alignment with the second input/output electrode;
- providing a first insulating layer on the first semiconductor substrate;
- providing an anchor pad on the first insulating layer;
- forming a second insulating layer on the first insulating layer;
- forming a first opening in the second insulating layer corresponding to the anchor pad;
- forming peripheral openings in the first and second insulating layers;
- providing a semiconductor material layer over the first and second insulating layers and in the first and peripheral openings;
- providing a third insulating layer and a conductive layer on the semiconductor material layer;
- forming the first contact electrode in the third insulating layer and conductive layer;
- forming the frame and the bar by removing portions of the semiconductor material layer;
- and
- removing the second insulating layer.
12 more elements
A method of manufacturing a micromechanical switch comprising:
- providing a bar overhanging a first semiconductor substrate and including a first contact electrode at an end thereof;
- providing a first frame projecting from the first semiconductor substrate;
- providing a second semiconductor substrate with conductive tracks, a second input/output electrode, a third starting electrode and first peripheral spacers defining a second frame projecting from the second semiconductor substrate and electrically connected to the conductive tracks;
- adjoining the first frame against the first peripheral spacers to define a chamber incorporating the bar therein with the first contact electrode in alignment with the second input/output electrode;
- providing a first insulating layer, a second insulating layer and a first conductive layer on the first semiconductor substrate;
- forming a third insulating layer and a second conductive layer on the first conductive layer;
- forming a fourth starting electrode in the second conductive layer;
- depositing a fourth insulating layer over the fourth starting electrode and third insulating layer;
- forming the first contact electrode on the fourth insulating layer;
- forming the bar in the fourth insulating layer and third insulating layer;
- and
- removing the first conductive layer.
9 more elements
A method of manufacturing a micromechanical switch comprising:
- providing a bar overhanging a first semiconductor substrate and including a first contact electrode at an end thereof;
- providing a first frame projecting from the first semiconductor substrate;
- providing a second semiconductor substrate with conductive tracks, a second input/output electrode, a third starting electrode and first peripheral spacers defining a second frame projecting from the second semiconductor substrate and electrically connected to the conductive tracks;
- adjoining the first frame against the first peripheral spacers to define a chamber incorporating the bar therein with the first contact electrode in alignment with the second input/output electrode;
- forming a return electrode on the first semiconductor substrate.
2 more elements
Dependencies are inferred from the claim text.