Positive photoresist composition

A positive photoresist composition comprising:

• (A) an oxime sulfonate compound represented by the following formula (1),
• (B) a resin comprising repeating units including a group represented by the following formula (X) and which increases the solubility in an alkaline developing solution by the action of an acid, and
• (C) a fluoroaliphatic-group-containing polymeric compound containing repeating units derived from a monomer represented by the following formula (2):
• wherein R1 and R2 each independently represents an alkyl group, an alkenyl group, an alkynyl group, an aryl group, a heterocyclic group, or a cyano group, provided that R1 and R2 may be bonded to each other to form a ring, and R3 represents an alkyl group or an aryl group, and
• R1 and R2 each may be bonded, through a single bond or a connecting group, to the R1 or R2 of another compound represented by formula (1):
• wherein R4 and R5 each independently represents a hydrogen atom or an alkyl group, Z represents an alkyl group, and
• m represents an integer of 1 to 20:
• wherein R6 represents a hydrogen atom or a methyl group, X represents an oxygen atom, a sulfur atom, or —N(R7)—, p represents an integer of 1 to 6, and q represents an integer of 2 to 4, provided that R7 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.