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US 7,022,412 B2Granted
Member having metallic layer, its manufacturing method and its application
AssigneeHitachi, Ltd.
InventorsHiroshi Yoshida, Toshiro Saito, Haruo Akahoshi
Life of this patent
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Abstract
A member useful in a printed wiring board comprises a resin insulating layer, a metallic fine particle or catalyst layer, a metal oxide layer, and a metallic or electroless plating layer, wherein the resin insulating layer contains a resin containing an aromatic amide site such as an epoxy-terminated aromatic polyamide.
Claims3
A wiring board comprising a member, said member comprising:
- a resin insulating layer;
- a metallic fine particle layer or catalyst layer formed on said resin insulating layer;
- a metal oxide layer formed on said metallic fine particle layer;
- and
- a metallic layer or electroless plating layer formed on said metal oxide layer,
- wherein the resin insulating layer comprises a resin containing an aromatic amide site in the chemical structure thereof, said resin comprising an epoxy group at a molecular terminal represented by the following chemical formula 5 or a structure having a reacted residue of said epoxy group:
- wherein R1, R2 and R3 represent a divalent organic group and m represents a natural number.
4 more elements
Dependencies are inferred from the claim text.