US 7,022,391 B2 · Packaging material for electronic-part case, and others

Abstract

The present invention provides a casing material for an electronic component which has a good adhesion with an aluminum foil and a resin layer, impermeability of steam, heat seal property, and corrosion resistance for an electrolyte. The present invention also provides a casing for an electronic component using the casing material. The present invention also provides an electronic component including the casing. The casing material comprises a heat resistant resin drawn film layer as an outer layer, a thermoplastic resin not-drawn film as an inner layer, and an aluminum foil layer provided between the layers. In particular, an acrylic polymer layer is provided between the aluminum foil layer and the not-drawn film layer.

Claims24

Dependent claims

A casing material for an electronic component, comprising:

an outer layer comprising a heat resistant resin drawn film;
an inner layer comprising a thermoplastic resin not-drawn film;
a foil layer comprising aluminum and provided between said outer layer and said inner layer;
and
a polymer layer provided between said foil layer and said inner layer, said polymer layer comprising an acrylic polymer having a hindered amine group, a cycloalkyl group and a benzotriazol group.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

10/398,653Filed 12 Oct 2001

Priority

JP 2000-31331113 Oct 2000

Published

US 2004/0142190 A122 Jul 2004

Granted

4 Apr 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification19 codes

H01G 9/08
Details: housing; Encapsulation
B32B 15/08
Comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material: of synthetic resin
H01G 11/78
Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the…:…
H01M 50/126
Having a layered structure: comprising three or more layers

Packaging material for electronic-part case, and others

Life of this patent

Packaging material for electronic-part case, and others

Life of this patent

Abstract

Claims24