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US 7,022,282 B2Granted
Lead-free solder and soldered article
AssigneeMurata Manufacturing Co., Ltd.
InventorsHidekiyo Takaoka, Kiyotaka Maegawa
Life of this patent
Estimating the term…
Abstract
A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.
Claims15
A lead-free solder consisting of:
- at least one selected from 0.01 to 0.2% by weight of Mn and 0.01 to 0.2% of Cr;
- at least one selected from 0.5 to 9% by weight of Ag and 0.5 to 5% by weight of Sb;
- and
- 90.5% by weight or more of Sn.
1 more element
Dependencies are inferred from the claim text.