Chemical-mechanical planarization composition with nitrogen containing polymer and method for use
AssigneeDuPont Air Products NanoMaterials LLC
InventorsJunaid Ahmed Siddiqui, Bin Hu
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Abstract
A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition comprises an organometallic-modified colloidal abrasive and a nitrogen-containing polymer compound (e.g., a polyalkyleneimine, such as polyamidopolyethyleneimine). The composition possesses both high stability towards gelling and/or solids formation and high selectivity for metal removal in metal CMP. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., copper CMP).
Claims16
A polishing composition comprising:
- a) an organometallic-modified abrasive;
- and
- b) a nitrogen-containing polymer compound;
- wherein the organometallic-modified abrasive is derived by surface modification of an unmodified abrasive with an organometallic compound, the unmodified abrasive possesses a negative zeta potential, and the organometallic-modified abrasive possesses a positive zeta potential in the polishing composition.
Dependencies are inferred from the claim text.