System and methods for analyzing copper chemistry
AssigneeAdvanced Technology Materials, Inc.
InventorCory Schomburg
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Abstract
The present invention relates to methods for removing the matrix effects caused by variance in copper concentration and acidity during measurement of the organic additive concentration in a sample copper plating solution.
Claims8
A method for determining copper concentration in a sample copper plating solution, comprising the steps of adding a chelating agent comprising at least one porphyrin into said sample plating solution to form a copper-porphyrin complex with copper ions therein, and measuring concentration of said copper-porphyrin complex, so as to determine the copper concentration in said sample copper plating solution.
Dependencies are inferred from the claim text.