Back to results
US 7,019,971 B2Granted
Thermal management systems for micro-components
AssigneeIntel Corporation
InventorsSabina Houle, James C. Matayabas, Jr.
Life of this patent
Estimating the term…
Abstract
Apparatus and methods for providing self-contained, closed-loop microchannel cooling systems that can be integrated into a micro-component package, such as a microelectronic package, are described herein.
Claims15
A micro-component device package, comprising:
- a micro-component device comprising a die and a carrier substrate, the die having a backside, the die being electrically interconnected with the carrier substrate;
- and
- a thermal management system in thermal engagement with the backside, the thermal management system comprising:
- a first substrate having a die facing side and an opposite heat dissipation side, the die facing side thermally coupled to the back side of the die;
- a microchannel structure having a plurality of outer walls enclosing a predefined area, the microchannel structure coupled to the heat dissipation side of the first substrate;
- a second substrate, the second substrate coupled to the microchannel structure, the first substrate, microchannel structure and the second substrate defining a closed volume microchannel;
- and
- a thermal interface material disposed within the closed volume microchannel.
5 more elements
A system comprising:
- a selected one of a digital signal processor and a graphics processor;
- and
- a micro-component device package coupled to the selected one of a digital signal processor and a graphics processor, including
- a micro-component device comprising a die and a carrier substrate, the die having a backside, the die being electrically interconnected with the carrier substrate;
- and
- a thermal management system in thermal engagement with the backside, the thermal management system comprising:
- a first substrate having a die facing side and an opposite heat dissipation side, the die facing side thermally coupled to the back side of the die;
- a microchannel structure having a plurality of outer walls enclosing a predefined area, the microchannel structure coupled to the heat dissipation side of the first substrate;
- a second substrate, the second substrate coupled to the microchannel structure, the first substrate, microchannel structure and the second substrate defining a closed volume microchannel;
- and
- a thermal interface material disposed within the closed volume microchannel.
8 more elements
Dependencies are inferred from the claim text.