Fabricating stacked chips using fluidic templated-assembly
AssigneeIntel Corporation
InventorDavid Gracias
Life of this patent
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Abstract
Fluidic self-assembly may be utilized to form a stack of two integrated circuits. The integrated circuits may include surface mount electrical connections and surface features that control the alignment between the integrated circuits. In particular, the contacts may be provided on one side of each integrated circuit and surface features may cause the integrated circuits to align with one another in an immersion fluid. The aligned circuits may join to form physical and electrical connections. The resulting structure may be a stack of two integrated circuits electrically coupled to one another.
Claims23
A method comprising:
- immersing an integrated circuit of a first type and an integrated circuit of a second type in an immersion fluid such that said circuits fit together in only one orientation wherein the integrated circuits are under a surface level of the immersion fluid.
A method comprising:
- immersing an integrated circuit of a first type and an integrated circuit of a second type in an immersion fluid including solder flux;
- and
- surface mounting said circuits of said first type to said circuits of said second type in said fluid.
A method comprising:
- immersing an integrated circuit of a first type and a integrated circuit of a second type in an immersion fluid;
- and
- surface mounting said circuits of said first type to said circuits of said second type by heating said immersion fluid.
A method comprising:
- forming solder balls on an integrated circuit of a first type;
- immersing said integrated circuit of said first type and an integrated circuit of a second type in an immersion fluid;
- and
- surface mounting said circuits of said first type to said circuits of said second type in said fluid.
Dependencies are inferred from the claim text.