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AssigneeRenesas Technology Corp.
InventorsMasatoshi Kanamaru, Takanori Aono, Tatsuya Nagata, Kenji Kawakami, Hideyuki Aoki
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A manufacturing method for improving the yield in a semiconductor manufacturing process and reducing the manufacturing cost produces a semiconductor device that is inexpensively manufactured and has a high reliability by reliably making contact during inspection with a suitable pressing force, while limiting damage to an electrode pad even when many inspected electrodes are inspected. A substrate used for inspection of the semiconductor device has a beam, a probe on the beam having a projecting shape for coming in contact with an electrode (electrode pad) of the semiconductor device, and a secondary electrode electrically connected to the probe through an electrically conductive member disposed on the side of the beam opposed to the side where the probe is provided. In an inspecting process, an inspecting device having a layer having many projections formed in the probe come in contact with the electrode pad of the semiconductor device.
A method of manufacture of a semiconductor device comprising a process for forming the semiconductor device on one principal surface of a wafer;
A method of manufacture of a semiconductor device comprising a forming process for forming a semiconductor device on one principal surface of a wafer;
A method of manufacture of a semiconductor device comprising a forming process for forming a semiconductor device on one principal surface of a wafer;
Dependencies are inferred from the claim text.