Non-contact data carrier and method of fabricating the same

A non-contact data carrier fabricating method comprising the steps of:

• preparing a conductive substrate;
• forming a first resist pattern layer provided with openings on one of the surfaces of the conductive substrate, and forming a second resist pattern layer provided with openings on the other surface of the conductive substrate;
• forming locating holes in the substrate by coating the first resist pattern layer with a protective film and etching the conductive substrate through the openings of the second resist pattern layer;
• forming a coil antenna having opposite ends, and a semiconductor device mount by removing the protective film from the first resist pattern layer and plating the conductive substrate through the openings of the first resist pattern layer;
• removing the first and the second resist pattern layer from the conductive substrate;
• fixedly mounting a semiconductor device on the semiconductor device mount and connecting the opposite ends of the coil antenna to the semiconductor device by wires;
• encapsulating the semiconductor device, the coil antenna, the wires and the surroundings of the semiconductor device mount with a sealing resin coating;
• and
• removing the conductive substrate from the semiconductor device mount and the coil antenna.