Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems

Abstract

Stable non-photosensitive polyimide precursor compositions with an adhesion promoter in a non-NMP solvent for use in forming high temperature resistant relief images and a process for making said images. The non-photosensitive polyimide precursor compositions comprise a) one or more polyamic acids soluble in gamma-butyrolactone (GBL) and aqueous tetramethyl ammonium hydroxide, and with the proviso that the polyamic acid is also resistant to a solvent used in a photosensitive composition with which the polyimide precursor composition is to be used; b) a solvent comprising gamma-butyrolactone; and c) one or more adhesion promoters selected from structures described by Formulae I–VI wherein R1 is H, C1–C10 linear, cyclic or branched alkyl, phenyl or halophenyl or alkyl substituted phenyl, R2 is C1–C10 linear, cyclic or branched alkyl, phenyl, halophenyl or alkyl substituted phenyl or one of the following moieties VII, VIII, or IX where R3 is C1–C4 linear or branched alkyl or C1–C4 linear or branched alkoxy group, R4, R5 and R6 are independently C1–C4 linear or branched alkyl group, m is an integer from 1 to about 4, and n is an integer from 1 to about 5.

Dependencies are inferred from the claim text.