Process for producing hard masks
AssigneeInfineonTechnologies AG
InventorsMichael Sebald, Ernst-Christian Richter
Life of this patent
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Abstract
In a process for producing hard masks, an initiator layer that contains an initiator component is applied to a substrate. Then, a photoresist is used to produce a pattern on the initiator layer, in the trenches of which pattern the initiator layer is uncovered. Then, a curable hard mask material is applied and selectively cured, so that only those sections of the hard mask material that adjoin the initiator layer are cured. Finally, uncured hard mask material is removed using a solvent, and at the same time the lands formed from the resist are also removed. The pattern obtained in this way can then be transferred to the substrate, for example using plasma.
Claims16
A process for producing patterned hard masks, which comprises the steps of:
- providing a substrate;
- applying an initiator component to the substrate resulting in an initiator layer being formed;
- applying a resist to the initiator layer;
- patterning the resist resulting in a patterned resist with lands and trenches disposed between the lands, the initiator layer being uncovered in the trenches;
- applying a hard mask material to the patterned resist resulting in a hard mask component being in contact with the initiator layer in the trenches;
- selectively curing parts of the hard mask component which are in contact with the initiator layer in the trenches;
- removing uncured hard mask material;
- and
- removing the patterned resist resulting in a hard mask in which positions of the lands of the patterned resist now removed correspond to newly formed trenches.
Dependencies are inferred from the claim text.