Structure for interconnecting conductors and connecting method
AssigneeRohm Co., Ltd.
InventorSatoshi Nakamura
Life of this patent
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Abstract
A first conductor having an Au layer formed on the surface is connected with a second conductor at least the surface of which has conductivity through a solder containing Zn. The first conductor is, for example, a terminal pad (11a, 11b, 11c) constituting a part of a wiring pattern on a circuit board (1), and the second conductor is, for example, a terminal (20a, 21a) or a terminal board (22) of an electronic component (20 21). The first conductor is connected with the second conductor through an Au—Zn alloy layer formed through diffusion of Zn from the solder containing Zn into the Au layer of the first conductor.
Claims13
A connection structure comprising a first conductor having a surface formed with an Au layer, a second conductor which is conductive at least at a surface thereof, and a solder for connecting the first conductor to the second conductor;
- wherein the solder is Pb-free and Cu-free, and comprises Sn and Zn;
- wherein the first conductor is connected to the second conductor via an Au—Zn alloy layer formed between the solder and the first conductor;
- and
- wherein the solder further contains Bi.
A method for connecting, via a solder, a first conductor to a second conductor which is conductive at least at a surface thereof, the first conductor having a surface formed with an Au layer, the solder being Pb-free and Cu-free, and comprising Sn and Zn;
- the method including the steps of interposing the solder between the first conductor and the second conductor, melting the solder to form an Au—Zn alloy layer between the solder and the first conductor acting as a barrier against diffusion of Au from the Au layer to the solder, and then solidifying the solder,
- wherein the solder further contains Bi.
Dependencies are inferred from the claim text.