Layer sequence built on a substrate in thin-film technology
AssigneeRobert Bosch GmbH
InventorsMartin Schallner, Soeren Steinert
Life of this patent
Estimating the term…
Abstract
The layer sequence built on a substrate in thin-film technology includes an electrically conductive sputtered layer and an electrically conductive reinforcing layer for reinforcing or strengthening the sputtered layer, which is applied on the sputtered layer by a method other than sputtering. In order to remove conducting material from the conductive layers with the aid of a laser for the purposes of adjustment while producing as little contaminating material as possible, the electrically conductive reinforcing layer has a reduced thickness or is completely eliminated in regions of the electrically conductive layers to be adjusted than in other regions outside of the regions to be adjusted.
Claims9
In a substrate and layer sequence built on said substrate in thin-film technology, said layer sequence comprising an electrically conductive sputtered layer, an electrically conductive reinforcing layer provided on the sputtered layer to reinforce or strengthen the sputtered layer and at least one electronic component, said reinforcing layer being provided by a method other than sputtering and material being removed from regions of said sputtered layer and said reinforcing layer by means of laser erosion in order to perform an electronic adjustment of said at least one electronic component, said laser erosion producing contaminating conductive deposits on said layer sequence, the improvement characterized by at least partially eliminating said electrically conductive reinforcing layer from said regions prior to said laser erosion;
- whereby said contaminating conductive deposits produced by said laser erosion are at least partially eliminated.
Dependencies are inferred from the claim text.