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US 7,018,718 B2Granted
Adhesive film for underfill and semiconductor device using the same
AssigneeNitto Denko Corporation
InventorsAkiko Matsumura, Kazuki Uwada, Naoki Sadayori, Yuji Hotta
Life of this patent
Estimating the term…
Abstract
An adhesive film for underfill excellent in relaxation effect of the stress generated in the above semiconductor element and the wiring circuit board and in the connecting electrode parts and also excellent in reliability of electrical connection between the semiconductor element and the wiring circuit board.
Claims4
An adhesive film for underfill comprising a polycarbodiimide copolymer which comprises at least one structural unit selected from rubber residues represented by the following formulae (1) and (2) in a number “m”:
- (wherein each of a, b and c is an integer of from 0 to 200, and X represents an alkylene group having from 0 to 5 carbon atoms) and a structural unit represented by the following formula (3) in a number “n”:
- R—N═C═N (3)
- (wherein R means an alkyl group having from 4 to 20 carbon atoms or an aryl group) and which comprises on each of the both termini a terminal structural unit derived from a monoisocyanate, wherein m is an integer of 2 or more, n is an integer of 1 or more, m+n is from 3 to 1,500 and m/(m+n) is from 1/1,500 to 1/3.
Dependencies are inferred from the claim text.