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US 7,018,678 B2Granted
Electronic device manufacture
AssigneeShipley Company, L.L.C.
InventorsDana A. Gronbeck, Michael K. Gallagher, Jeffrey M. Calvert, Gregory P. Prokopowicz, Timothy G. Adams
Life of this patent
Estimating the term…
Abstract
Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits.
Claims15
A method for depositing an organic polysilica cap layer on a dielectric material comprising the steps of:
- a) disposing a cap layer composition on a dielectric material, the cap layer composition comprising one or more B-staged organic polysilica resins and one or more coating enhancers;
- and b) at least partially curing the B-staged organic polysilica resin to form a cap layer;
- wherein the coating enhancer is present in an amount sufficient to provide a pinhole-free cap layer and wherein the cap layer has an etch selectivity of 3:1 greater as compared to the dielectric material.
A method for manufacturing a device comprising the steps of:
- a) providing a dielectric material;
- b) disposing a cap layer composition on the dielectric material, the cap layer composition comprising one or more B-staged organic polysilica resins and one or more removable porogens;
- and b) at least partially curing the one or more B-staged organic polysilica resin to form a cap layer;
- wherein the one or more removable porogens are present in an amount sufficient to provide a pinhole-free cap layer, and wherein the can layer has an etch selectivity of 3:1 or greater as compared to the dielectric material.
1 more element
A method for depositing an organic polysilica cap layer on a dielectric material comprising the steps of:
- a) disposing a cap layer composition on a dielectric material having a dielectric constant of ≦3, the cap layer composition comprising one or more B-staged organic polysilica resins and one or more coating enhancers;
- and b) at least partially curing the B-staged organic polysilica resin to form a cap layer;
- wherein the coating enhancer is present in an amount sufficient to provide a pinhole-free cap layer, and wherein the cap layer has an etch selectivity of 3:1 or greater as compared to the dielectric material.
Dependencies are inferred from the claim text.