Circuit board producing method and circuit board producing device
AssigneeMatushita Electric Industrial Co., Ltd.
InventorsToshiaki Takenaka, Toshihiro Nishii, Yuichiro Sugita, Shinji Nakamura, Hideaki Komoda, Toshikazu Kondo
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Abstract
A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through-holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through-holes or the blind-holes.
Claims21
A method of manufacturing a circuit board comprising:
- bonding release films to both surfaces of a board material;
- forming holes in said board material with said release films bonded on both surfaces thereof, wherein said holes are selected from the group consisting of through-holes and blind-holes;
- filling paste into said holes with a squeegee, said filling step comprising the steps of,
- filling a first paste into said holes,
- supplying a second paste to said first paste on a frame after said first paste has been filled into said holes;
- and
- kneading said second paste with said first paste on the frame during backward motion of the squeegee.
Dependencies are inferred from the claim text.