Conductive thin film pattern and method of forming the same, method of manufacturing thin film magnetic head, method of manufacturing thin film inductor, and method of manufacturing micro device

A method of manufacturing a thin film magnetic head including a conductive thin film pattern,

• wherein a step of forming the conductive thin film pattern comprises:
• a first step of forming an underfilm made of a conductor on a substrate;
• a second step of selectively forming a first resist frame on the underfilm;
• a third step of forming a first conductive layer pattern by selective plating growth using the first resist frame as a mask and using the underfilm film as an electrode film;
• a fourth step of forming an intermediate conductive layer so as to cover the first resist frame and the first conductive layer pattern;
• a fifth step of selectively forming a second resist frame on the intermediate conductive layer in a position corresponding to the first resist frame;
• a sixth step of forming a second conductive layer pattern by selective plating growth using the second resist frame as a mask and using the intermediate conductive layer as an electrode film;
• and
• a seventh step of completing formation of the conductive thin film pattern by removing the first and second resist frames, the intermediate conductive layer in a portion sandwiched by the resist frames, and the underfilm.

A method of manufacturing a thin film inductor including a conductive thin film pattern,

• wherein a step of forming the conductive thin film pattern comprises:
• a first step of forming an underfilm made of a conductor on a substrate;
• a second step of selectively forming a first resist frame on the underfilm;
• a third step of forming a first conductive layer pattern by selective plating growth using the first resist frame as a mask and using the underfilm as an electrode film;
• a fourth step of forming an intermediate conductive layer so as to cover the first resist frame and the first conductive layer pattern;
• a fifth step of selectively forming a second resist frame on the intermediate conductive layer in a position corresponding to the first resist frame;
• a sixth step of forming a second conductive layer pattern by selective plating growth using the second resist frame as a mask and using the intermediate conductive layer as an electrode film;
• and
• a seventh step of completing formation of the conductive thin film pattern by removing the first and second resist frames, the intermediate conductive layer in a portion sandwiched by the resist frames, and the underfilm.

A method of manufacturing a micro device including a conductive thin film pattern,

• wherein a step of forming the conductive thin film pattern comprises:
• a first step of forming an underfilm made of a conductor on a substrate;
• a second step of selectively forming a first resist frame on the underfilm;
• a third step of forming a first conductive layer pattern by selective plating growth using the first resist frame as a mask and using the underfilm as an electrode film;
• a fourth step of forming an intermediate conductive layer so as to cover the first resist frame and the first conductive layer pattern;
• a fifth step of selectively forming a second resist frame on the intermediate conductive layer in a position corresponding to the first resist frame;
• a sixth step of forming a second conductive layer pattern by selective plating growth using the second resist frame as a mask and using the intermediate conductive layer as an electrode film;
• and
• a seventh step of completing formation of the conductive thin film pattern by removing the first and second resist frames, the intermediate conductive layer in a portion sandwiched by the resist frames, and the underfilm.

A method of forming a thin film coil, comprising:

• a first step of forming an underfilm made of a conductor on a substrate;
• a second step of selectively forming a first resist frame on the underfilm;
• a third step of forming a first conductive coil layer pattern by selective plating growth using the first resist frame as a mask and using the underfilm as an electrode film;
• a fourth step of forming an intermediate conductive layer so as to cover the first resist frame and the first conductive coil layer pattern;
• a fifth step of selectively forming a second resist frame on the intermediate conductive layer in a position corresponding to the first resist frame;
• a sixth step of forming a second conductive coil layer pattern by selective plating grown using the second resist frame as a mask and using the intermediate conductive layer as an electrode film;
• and
• a seventh step of completing formation of the conductive thin film pattern by removing the first and second resist frames, the intermediate conductive layer in a position sandwiched by the resist frames, and the underfilm.