Selectable dual position magnetron
AssigneeApplied Materials, Inc.
InventorsTza-Jing Gung, Hong S. Yang, Anantha K. Subramani, Maurice E. Ewert, Keith A. Miller, Vincent E. Burkhart
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AssigneeApplied Materials, Inc.
InventorsTza-Jing Gung, Hong S. Yang, Anantha K. Subramani, Maurice E. Ewert, Keith A. Miller, Vincent E. Burkhart
Estimating the term…
A dual-position magnetron that is rotated about a central axis in back of a sputtering target, particularly for sputtering an edge of a target of a barrier material onto a wafer and cleaning material redeposited at a center of the target. During target cleaning, wafer bias is reduced. In one embodiment, an arc-shaped magnetron is supported on a pivot arm pivoting on the end of a bracket fixed to the rotary shaft. A spring biases the pivot arm such that the magnetron is urged towards and overlies the target center. Centrifugal force at increased rotation rate overcomes the spring bias and shift the magnetron to an outer position with the long magnetron dimension aligned with the target edge. Mechanical stops prevent excessive movement in either direction. Other mechanisms include linear slides and actuators.
A method of sputtering in a plasma sputter reactor arranged about a central axis and having a target in opposition to a pedestal supporting a substrate to be sputter coated with a material of said target, including the steps of:
A multi-position magnetron, comprising:
A multi-position magnetron for a plasma sputter reactor, comprising:
A multi-position magnetron for a plasma sputter reactor, comprising:
A dual position magnetron for scanning a target having a central axis in a plasma sputter reactor, comprising:
A magnetron sputter reactor, comprising:
A method of operating a magnetron sputter reactor comprising a rotary drive shaft supporting a magnetron pivotally supported on a bracket connected to said rotary drive shaft and biased towards said central axis, said method comprising the steps of:
A multi-position magnetron for a plasma sputter reactor, comprising:
Dependencies are inferred from the claim text.