Interconnect structure and method for connecting buried signal lines to electrical devices
OwnerSteven A. Rosenauinventor
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OwnerSteven A. Rosenauinventor
Estimating the term…
An electrical component, such as a trace, signal line, or contact pad connected to the trace or signal line, is covered by one or more layers. The electrical component is connected directly to an electrical device by forming an opening through the one or more layers. The opening exposes a portion of the electrical component. A connector, such as a solder ball, a pin contact, or a wire bond, is then attached to the exposed portion of the electrical component. The connector connects directly to another electrical device to create an electrical connection between the electrical component and the electrical device. The electrical device may be configured, for example, as a second signal line or contact pad in another stripline circuit, a microstrip circuit, an integrated circuit, or an electrical component.
An interconnect for connecting an electrical component covered by two or more layers in a first stripline circuit to an electrical device, wherein the two or more layers comprise a dielectric layer covered by a ground layer, the interconnect comprising:
An interconnect, comprising;
A stripline circuit, comprising:
A method for fabricating an interconnect between an electrical component in a first stripline circuit and an electrical device, wherein the electrical component is covered by two or more layers comprising a dielectric layer covered by a ground layer, the method comprising:
A method for fabricating an interconnect in a stripline circuit, comprising:
Dependencies are inferred from the claim text.