Solder pastes for providing high elasticity, low rigidity solder joints
AssigneeIndium Corporation of America
InventorsYan Liu, Derrick Herron, Ning-Cheng Lee
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Abstract
Solder pastes for providing high elasticity, low rigidity solder joints are disclosed. The solder pastes may be used between two parts having large mismatches in their coefficients of thermal expansion and/or when there is a high likelihood of mechanical deformity when the two parts are soldered together. In one particular exemplary embodiment, a solder paste may be realized as a composition comprising a solder powder and high melting temperature particles with a flux, wherein the ratio between solder powder and high melting temperature particles may be between 2:1 and 1:10.
Claims19
A solder paste comprising:
- a solder powder;
- high melting temperature solderable particles;
- and
- a flux;
- wherein the high melting temperature solderable particles have a melting temperature higher than a soldering temperature of the solder paste, wherein the solder paste has a volume ratio of solder powder to high melting temperature solderable particles between 2:1 and 1:10, and wherein the high melting temperature solderable particles are treated chemically prior to mixing with the solder powder and flux.
A method of manufacturing a solder joint comprising:
- mixing a solder powder and high melting temperature solderable particles with a flux to form a solder paste, wherein the high melting temperature solderable particles have a melting temperature higher than a soldering temperature of the solder paste, wherein the solder paste has a volume ratio of solder powder to high melting temperature solderable particles between 2:1 and 1:10, and wherein the high melting temperature solderable particles are treated chemically prior to mixing with the solder powder and flux.
A method for connecting electrical components with solder interconnections comprising:
- chemically treating a high melting temperature solderable particle material wherein the solder paste has a volume ratio of solder powder to high melting temperature particle material between 2:1 and 1:10;
- mixing a solder powder, the high melting temperature solderable particle material, and a flux to form a solder paste, wherein the solder paste has a volume ratio of solder powder to high melting temperature solderable particle material between 2:1 and 1:10;
- dispensing or printing the solder paste onto a pad;
- placing a component onto the deposited solder paste to make an assembly;
- heating the assembly to a temperature above a melting temperature of the solder powder, but below that of the high melting temperature solderable particle material;
- and
- cooling the assembly.
Dependencies are inferred from the claim text.