Apparatus and method for splitting substrates

An apparatus for splitting apart a substrate comprising two adjoining wafers defining between them a cleavage plane, which comprises:

• means for feeding a plurality of substrates disposed in a substrate-storage direction;
• splitter means comprising a first jaw-forming comb assembly that includes a plurality of openings for receiving the substrates, with each opening receiving a substrate, and at least two moving jaws situated on either side of a gap for receiving the substrates and splitting apart the wafers;
• wherein the jaws are suitable for holding the substrates once the jaws have clamped onto the substrates;
• wherein each jaw comprises first and second portions that have corresponding concave housings for receiving and holding the substrates;
• and
• wherein the corresponding housings have a shape that is configured and adapted so that once the first and second portions of the two jaws have clamped onto the substrates, the two wafers of each substrate are urged apart by co-operation between the shapes of the housings of the first portions of the two jaws and the second portions of the two jaws, respectively;
• and
• means for performing controlled displacement of certain wafers after they have been split apart in a direction that is substantially parallel to the substrate-storage direction.

An apparatus for splitting apart a substrate comprising two adjoining wafers defining between them a cleavage plane, which comprises:

• means for feeding a plurality of substrates disposed in a substrate-storage direction;
• a separator suitable for movement between a position in which the substrates are disengaged from the separator, and a position in which the substrates are attacked by the separator to split apart the wafers;
• and
• a first comb comprising at least two moving jaws for taking hold of the substrates after the substrates have been attacked by the separator;
• wherein the jaws hold the substrates after being clamped thereon;
• and
• each jaw has spaced apart housings so that once the jaws have been clamped onto the substrates, the wafers of the substrates are spaced apart in the housings.

An apparatus for splitting apart a substrate comprising two adjoining wafers defining between them a cleavage plane, which comprises:

• a cradle support for holding a plurality of substrates in a substrate-storage direction
• a pusher operatively associated with the cradle support for moving substrates out of the cradle support;
• a first jaw-forming comb assembly that includes a plurality of openings for receiving the plurality of substrates with each opening receiving a substrate, and at least two moving jaws situated on either side of a gap for receiving the substrates, the jaws holding the substrates once clamped thereonto, with the movement of one of the comb assembly or the jaws causing the wafers to split apart;
• and
• a member for moving one portion of each jaw in translation relative to another portion of the jaw in a direction perpendicular to the general plane of a substrate storage direction thus performing controlled displacement of wafers after they have been split apart in a direction that is substantially parallel to the substrate-storage direction.

An apparatus for splitting apart a substrate comprising two adjoining wafers defining between them a cleavage plane, which comprises:

• a cradle support for holding a plurality of substrates in a substrate-storage direction
• a pusher operatively associated with the cradle support for moving substrates from out of the cradle support;
• a first jaw-forming comb assembly that includes a plurality of openings for receiving a plurality of substrates, with each opening receiving a substrate, and at least two moving jaws situated on either side of a gap for receiving the substrates, the jaws holding the substrates once the clamped thereonto, with the movement of the jaws caused with wafers to split apart;
• and
• a member for moving one portion of each jaw in translation relative to another portion of the jaw in a direction perpendicular to the general plane of the projecting element thus performing controlled displacement of wafers after they have been split apart in a direction that is substantially parallel to the substrate-storage direction.