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US 7,017,428 B2Granted
Test kit for semiconductor package and method for testing semiconductor package using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsByoung-jun Min, Jeong-ho Bang, Hyun-seop Shim, Hyo-geun Chae
Life of this patent
Estimating the term…
Abstract
A test kit for a semiconductor package and a method for testing the semiconductor package using the same are provided. The test kit for a semiconductor package includes a pick-and-place tool for picking up and loading/unloading the semiconductor package, a head assembly having a package guider and a socket guider, and a socket which is positioned under the head assembly. The socket guider performs a pre-alignment function for a correct operation of the package guider, before the package guider starts operating. The package guider aligns the semiconductor package.
Claims25
A test kit for a semiconductor package comprising:
- a pick-and-place tool structured to load/unload the semiconductor package;
- a head assembly coupled with the pick-and-place tool;
- and
- a socket underneath the head assembly, the socket being configured to connect the semiconductor package loaded by the pick-and-place tool and the head assembly to a tester,
- the head assembly including an upwardly disposed package guider configured automatically to align the semiconductor package as the package is released by and falls from the pick-and-place tool, and a downwardly disposed socket guider mounting the upwardly disposed package guider, the socket guider configured automatically to pre-align the head assembly with a position of the socket by downward contact between the socket guider and a socket cover connected with the socket before operation of the package guider,
- the socket aligned with and positioned under the socket cover.
3 more elements
A test kit for a semiconductor package comprising:
- a pick-and-place tool structured to load/unload the semiconductor package;
- a head assembly including a package guider for aligning the semiconductor package falling from the pick-and-place tool, and a socket guider for pressing a socket cover at an edge of the package guider before the package guider operates and for performing a pre-alignment function for an operation of the package guider when the socket guider contacts the socket cover;
- and
- a socket which is positioned under the head assembly and connects the semiconductor package loaded by the pick-and-place tool and the head assembly to a tester, wherein the socket includes a free-sized adapter formed on the socket contact board,
- wherein the free-sized adapter is structured to ensure a space for positioning the package guider when the external connection terminals of the semiconductor package are connected to the socket pins of the socket contact board and to protect surfaces of the socket contact board.
2 more elements
A test kit for a semiconductor package comprising:
- a pick-and-place tool structured to load/unload the semiconductor package;
- a head assembly including a package guider for aligning the semiconductor package falling from the pick-and-place tool, and a socket guider for pressing a socket cover at an edge of the package guider before the package guider operates and for performing a pre-alignment function for an operation of the package guider when the socket guider contacts the socket cover;
- and
- a socket which is positioned under the head assembly and connects the semiconductor package loaded by the pick-and-place tool and the head assembly to a tester,
- wherein the package guider of the head assembly includes:
- inclined portions which are formed at four corners of the package guider, the semiconductor package body sliding while contacting one or more of the inclined portions and being aligned;
- and
- an alignment portion in which the semiconductor package sliding along one or more of the inclined portions falls in an aligned state.
5 more elements
A test kit for the semiconductor package comprising:
- a pick-and-place tool structured to load/unload the semiconductor package;
- a head assembly including a package guider for aligning the semiconductor package falling from the pick-and-place tool, and a socket guider for pressing a socket cover at an edge of the package guider before the package guider operates and for performing a pre-alignment function for an operation of the package guider when the socket guider contacts the socket cover;
- and
- a socket which is positioned under the head assembly and connects the semiconductor package loaded by the pick-and-place tool and the head assembly to a tester,
- wherein corners of the socket cover slide along one or more of inclined surfaces formed at ends of the socket guider when the socket cover is pressed and are inserted into the socket guider so that the socket guider performs an alignment function of matching a position of the head assembly with a position of the socket.
2 more elements
A method for testing a semiconductor package comprising:
- performing a first alignment by docking a socket guider of a head assembly on a socket cover of one of a plurality of sockets on an interface board;
- opening a latch of the socket by pressing the socket cover using a package guider of the head assembly;
- performing a second alignment of the semiconductor package that is loaded in a pick-and-place tool with the package guider;
- mounting the semiconductor package on a socket contact board formed inside the socket;
- affixing the semiconductor package by the latch by removing pressing force from the package guider;
- separating the semiconductor package from the pick-and-place tool;
- and
- performing an electrical test for the semiconductor package mounted on the socket contact board.
5 more elements
Dependencies are inferred from the claim text.