Method for manufacturing multilayer wiring board, and multilayer wiring board manufactured thereby
AssigneeFujitsu Limited
InventorsMotoaki Tani, Nobuyuki Hayashi, Tomoyuki Abe
Life of this patent
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Abstract
A method is provided for manufacturing a multilayer wiring board wherein good adhesion is achieved between an insulating layer and a wiring pattern. The multilayer wiring board has a laminar structure which includes insulating layers and a wiring pattern. The method includes at least the steps of sticking a support whose surface has been treated with a coupling agent onto an insulating layer with a coupling agent interposed therebetween, and transferring the coupling agent to the insulating layer by removing the support while leaving the coupling agent on the insulating layer.
Claims18
A method for manufacturing a multilayer wiring board having a laminar structure which includes an insulating layer and a wiring layer, the method comprising the steps of:
- sticking a support, which has a surface treated with a coupling agent, onto the insulating layer with the coupling agent interposed therebetween;
- transferring the coupling agent from the support to the insulating layer by removing the support while leaving the coupling agent on the insulating layer;
- partially etching the insulating layer;
- and
- forming a wiring pattern on the partially etched insulating layer onto which the coupling agent has been transferred.
A method for manufacturing a multilayer wiring board, comprising the steps of:
- treating a surface of a support with a coupling agent;
- forming an insulating layer on a surface of a substrate which is formed with a first wiring pattern;
- sticking the support onto the insulating layer with the coupling agent interposed therebetween;
- transferring the coupling agent to the insulating layer by removing the support while leaving the coupling agent on the insulating layer;
- and
- forming a second wiring pattern on the insulating layer onto which the coupling agent has been transferred.
A method for manufacturing a multilayer wiring board having a laminar structure which includes an insulating layer and a wiring layer, the method comprising the steps of:
- sticking a support, which is formed with a metal-containing bonding layer having an exposed surface treated with a coupling agent, onto the insulating layer with the coupling agent and the metal-containing bonding layer interposed therebetween;
- transferring the coupling agent and the metal-containing bonding layer from the support to the insulating layer by removing the support while leaving the coupling agent and the metal-containing bonding layer on the insulating layer;
- partially etching the insulating layer;
- and
- forming a wiring pattern on the partially etched insulating layer onto which the coupling agent and the metal-containing bonding layer have been transferred.
A method for manufacturing a multilayer wiring board, comprising the steps of:
- forming a metal-containing bonding layer on a support;
- treating an exposed surface of the metal-containing bonding layer with a coupling agent;
- forming an insulating layer on a surface of a substrate which is formed with a first wiring pattern;
- sticking the support onto the insulating layer with the coupling agent and the metal-containing bonding layer interposed therebetween;
- transferring the coupling agent and the metal-containing bonding layer to the insulating layer by removing the support while leaving the coupling agent and the metal-containing bonding layer on the insulating layer;
- and
- forming a second wiring pattern on the metal-containing bonding layer.
Dependencies are inferred from the claim text.