Method of manufacturing multilayer wiring board
AssigneeNitto Denko Corporation
InventorsKenichi Ikeda, Toshiyuki Kawashima, Nobuharu Tahara, Kazuo Oouchi
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Abstract
The present invention provides a method of manufacturing a multilayer wiring board comprising the step of impregnating a raw material composition of a thermosetting resin in a porous laminated product including two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers and of half curing or curing them. Moreover, the present invention provides a multilayer wiring board having such a lamination structure that two or more porous layers and a wiring layer provided between the porous layers and formed on any of the porous layers are integrated through an impregnated and cured thermosetting resin.
Claims7
A method of manufacturing a multilayer wiring board comprising the steps of:
- providing a porous laminated product comprising (i) two or more porous layers, (ii) at least one wiring layer provided between the porous layers and formed on any of the porous layers, and (iii) at least one interconnect which penetrates at least one of the porous layers and contacts the wiring layer;
- impregnating the porous laminated product with a raw material composition of a thermosetting resin;
- and
- half curing or curing the raw material composition impregnated in the porous laminated product.
A method of manufacturing a multilayer wiring board comprising the steps of:
- providing a metal foil having conductive bumps of almost equal height on its surface;
- form and attach a resin porous layer onto the surface of the metal foil with the conductive bumps by a wet coagulating method;
- etching the metal foil to form a pattern portion of a wiring layer, thereby obtaining a lamination unit;
- providing a porous laminated product comprising two or more of the lamination units;
- impregnating the porous layers with a raw material composition of a thermosetting resin;
- and
- half curing or curing the raw material composition.
Dependencies are inferred from the claim text.