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US 7,017,263 B2Granted
Electronic component mounting method
AssigneeHitachi High-Tech Instruments Co., Ltd.
InventorTsutomu Yanagida
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AssigneeHitachi High-Tech Instruments Co., Ltd.
InventorTsutomu Yanagida
Estimating the term…
The invention provides an electronic component mounting method which improves a work efficiency and enables pickup of electronic components without fail. A component feeding unit mounted with a master tape formed with pickup position indication holes is fixed to an adjusting jig. A recognition camera takes an image of a recognition mark to calculate a center position thereof, moves to a position corresponding to a component pickup position previously stored in a memory portion, and takes an image of the pickup position indication hole provided in the master tape to calculate a component pickup position. Data on a positional relationship between the recognition mark and the pickup position based on a result of this recognition processing are stored in a memory in the component feeding unit. The component feeding units each mounted with a storage tape are fixed to a base of an electronic component mounting apparatus. When an electronic component mounting operation is performed, a board recognition camera takes an image of the recognition mark provided in the component feeding unit to calculate a center position thereof, and the CPU corrects a pickup position of a suction nozzle based on the pickup position data stored in the memory.
A method of mounting an electronic component, comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
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Term ended 21 Aug 2024 (estimated)
This invention is based on Japanese Patent Application No. 2003-145834, the content of which is incorporated by reference in its entirety.
1. Field of the Invention
The invention relates to an electronic component mounting method in which a storage tape stored with electronic components in its storage portions is intermittently fed by a component feeding unit, and a suction nozzle picks the electronic components up from the storage tape and mounts the electronic components on a printed board.
FIG. 1 is a plan view of an electronic component mounting apparatus of an embodiment of the invention.
FIG. 2 is a side view of a component feeding unit of the apparatus of FIG. 1.
FIG. 3 is a partial side view of the component feeding unit of the apparatus of FIG. 1.
An electronic component mounting apparatus having an electronic component feeding device of one embodiment of the invention will be described with reference to the drawings. This electronic component mounting apparatus is a so-called multifunctional chip mounter, which can mount a variety of electronic components A on a printed board P.
FIG. 1 is a plan view of the electronic component mounting apparatus. An electronic component mounting apparatus 1 includes a base 2, a conveyer portion 3 extending in a lateral direction in a center of the base 2, and two component mounting portions 4 and two component feeding portions 5 each provided on the front (on a lower side of FIG. 1) and the rear (on an upper side of FIG. 1) of the base 2. Each of the component feeding portions 5 is detachably set with a plurality of component feeding units 6 as the electronic component feeding device.
The conveyer portion 3 includes a central set table 8, a left feeding conveyer 9, and a right discharging conveyer 10. The printed board P is supplied from the feeding conveyer 9 to the set table 8, and is fixed at a predetermined height so as to be mounted with electronic components. After completing the electronic component mounting, the printed board P is discharged from the set table 8 to a downstream device through the discharging conveyer 10.