US 7,017,258 B2Granted

Mounting system for high-mass heatsinks

AssigneeIntel Corporation

InventorsMichael Z. Eckblad, Mark W. Anderson

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Abstract

A system for mounting heatsinks, in particular, high-mass heatsinks, on printed circuit boards, such as motherboards. The mounting system includes a backplate, disposed beneath the motherboard, with pins protruding up through the motherboard, and a linkage assembly, which is fixably attached to a base portion of a heatsink assembly. The linkage assembly includes scoops, for grasping the pins during engagement, and a ratcheting system, for compressing the heatsink and thermal interface material onto the package. The mounting system is designed to effectively distribute the heatsink weight, as well as the forces caused by chronic and dynamic stresses, through, rather than upon the motherboard, such as to a chassis. The mounting system thus alleviates stress cracks, component pullout, solderball stress, and other damaging conditions to the motherboard. The mounting system may be engaged and disengaged without the use of tools.

Claims22

Dependent claims

A mounting system, comprising:

a backplate for positioning beneath a processor package on a motherboard, the backplate having a plurality of pins extending upward from and transverse to the backplate, the pins each including a tip;
and
a linkage assembly disposed upon a heatsink assembly, the heatsink assembly comprising a base portion, the linkage assembly comprising:
a first rod disposed transverse through a first pressure block and a second pressure block;
a second rod disposed transverse through a third pressure block and a fourth pressure block, wherein the first, second, third, and fourth pressure blocks are permanently affixed to the base portion of the heatsink assembly;
a pair of scoops, a first scoop being threaded through and transverse to the first rod, a second scoop being threaded through and transverse to the second rod, each scoop including a pair of claws for grasping the tip of the pins;
and
a ratchet assembly for coupling the linkage assembly with the backplate;
wherein the claws securely grasp the tip of the pins such that the heatsink assembly is pulled toward the processor package while the backplate provides an opposing force to the heatsink assembly.

6 more elements

A mounting system, comprising:

a backplate for positioning beneath a processor package on a motherboard, the backplate having a plurality of pins extending upward from and transverse to the backplate;
and
a linkage assembly disposed upon a heatsink assembly, the heatsink assembly comprising a base portion and having a predetermined weight, the linkage assembly comprising:
a first rod disposed transverse through a first pressure block and a second pressure block;
a second rod disposed transverse through a third pressure block and a fourth pressure block, wherein the first, second, third, and fourth pressure blocks are permanently affixed to the base portion of the heatsink assembly;
a pair of scoops, a first scoop being threaded through and transverse to the first rod, a second scoop being threaded through and transverse to the second rod;
and
a ratchet assembly for coupling the linkage assembly with the backplate;
wherein the predetermined weight of the heatsink assembly is absorbed by the mounting pins and backplate when the mounting assembly is fully engaged.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 10/764,976Filed 26 Jan 2004
Published: US 2005/0160592 A128 Jul 2005
Granted: 28 Mar 2006
Term ends: Not estimatedThe source records don’t support an estimate.

Classification12 codes

H10W 40/037
Of arrangements for cooling: assembling together parts thereof
H10W 40/641
Securing means for detachable heating or cooling arrangements, e.g. clamps: snap-on arrangements, e.g. clips
Y10T 29/49126
On flat or curved insulated base, e.g., printed circuit, etc.: assembling bases
Y10T 29/4913
On flat or curved insulated base, e.g., printed circuit, etc.: assembling to base an electrical component, e.g., capacitor, etc.