Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
AssigneeToho Engineering Kabushiki Kaisha
InventorTatsutoshi Suzuki
Life of this patent
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Abstract
Disclosed is a turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material and utilized for polishing semiconductor devices. The turning tool comprising a cutting part arranged to have a tooth width within a range of 0.005–1.0 mm, a wedge angle within a range of 15–35 degrees, and a front clearance angle within a range of 65–45 degrees. A polishing pad effectively formed by using the turning tool, and an apparatus and a method of producing such a polishing pad by utilizing the turning tool are also disclosed.
Claims16
A turning tool for cutting circumferential grooves into a surface of a polishing pad formed of a resin material for polishing semiconductor devices, said turning tool comprising:
- at least one plate-like shaped tool tip and
- at least one cutting part extending from one side of the at least one tool tip,
- wherein the at least one cutting part has a width within a range of 0.005–1.0 mm, a wedge angle within a range of 15–35 degrees, and a front clearance angle within a range of 65–45 degrees, for cutting circumferential grooves into the surface of the resin polishing pad.
Dependencies are inferred from the claim text.