Method and apparatus for intra-layer transitions and connector launch in multilayer circuit boards

A multi-layer circuit board having a first via with at least a first signal input location and a second via having at least a first signal output location, said first via and said second via being drilled completely through said multi-layer circuit board, said circuit board comprising:

• a plurality of electrical paths between said first signal input location and said first signal output location;
• wherein a first end of said first via is connected to a first end of said second via thereby forming a first electrical path, and a second end of said first via is connected to a second end of said second via thereby forming a second electrical path, such that an input signal received at said first signal input location travels partly in a first direction in said first via and partly in a second direction through said first via, said first direction being opposite that of said second direction;
• wherein the electrical length of each of said plurality of electrical paths are equal, and said first electrical path and said second electrical path have a same starting point and ending point, and
• wherein any signal degradation, as a function of amplitude loss, between said first input location and said first output location attributable to said first via and said second via is substantially eliminated.

A method for reducing resonance in a multi-layer circuit board, said method comprising:

• disposing a first via having a signal input location on said circuit board, said first via being disposed completely through said multi-layer circuit board;
• disposing a second via having a signal output location on said circuit board, said second via being disposed completely through said multi-layer circuit board;
• electrically connecting said first via and said second via by connecting a first end of said first via to a first end of said second via, forming a first electrical path between said signal input location and said signal output location;
• and
• electrically connecting said first via and said second via by connecting a second end of said first via to a second end of said second via, forming a second electrical path between said signal input location and said signal output location, such that an input signal received at said signal input location travels partly in a first direction in said first via and partly in a second direction through said first via, said first direction being opposite that of said second direction;
• wherein the electrical length of said first electrical path equals the electrical length of said second electrical path, and said first electrical path and said second electrical path have a same starting point and ending point, and
• wherein any signal degradation, as a function of amplitude loss, between said signal input location and said signal output location attributable to said first via and said second via is substantially eliminated.