Apparatus and method for coupling to a memory module
AssigneeIntel Corporation
InventorsDavid W. Frame, Christopher J. Banyai, Karl H. Mauritz, Albert R. Nelson, Quing-Lun Chen, Hany M. Fahmy
Life of this patent
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Abstract
Briefly, in accordance with one embodiment of the invention, a system includes two boards coupled by a bus. The bus having a dual-terminated transmission line that communicatively couples a memory control hub with a memory repeater hub that each have a Rambus ASIC Cell (RAC). Briefly, in accordance with another embodiment of the invention, a connector has two metal traces that are of different lengths. The parasitic capacitance of the longer metal trace is increased so that the impedance of the two metal traces is substantially equal.
Claims17
An apparatus comprising:
- a first integrated circuit comprising a Direct Rambus™ ASIC Cell (Direct RAC);
- a second integrated circuit comprising a Direct RAC;
- a mezzanine card having a connector and comprising the second integrated circuit, wherein the connector is adapted to be communicatively coupled to a third integrated circuit, wherein the connector includes a first metal line and a second metal line, the second metal line being longer than the first metal line, and wherein the second metal line has a parasitic capacitance value greater than a parasitic capacitance value of the first metal line;
- and
- a dual-terminated transmission line, wherein the dual-terminated transmission line communicatively couples the Direct RAC of first integrated circuit with the Direct RAC of the second integrated circuit.
An article comprising:
- a memory module including a connector that is adapted to be coupled to a first integrated circuit;
- and
- wherein the connector has a first line and a second line, the second line being longer than the first line, the second line having a capacitance value greater than a capacitance value of the first line, and wherein impedance of the second line is approximately equal to impedance of the first line.
A method of making an article, comprising:
- providing a first integrated circuit having a communication module;
- providing a connector having a first line and a second line, wherein the first line and the second line are communicatively coupled to the first integrated circuit, and wherein the second line is longer than the first line, has a capacitance value greater than a capacitance value of the first line, and impedance of the second line is approximately equal to impedance of the first line;
- providing a second integrated circuit have a communication module;
- and
- forming a dual-terminated transmission line to couple the first integrated circuit to the second integrated circuit.
Dependencies are inferred from the claim text.