Dynamic creation and modification of wafer test maps during wafer testing

A method for dynamic wafer map creation, comprising:

• loading a wafer test plan;
• testing a first test map against a wafer;
• obtaining first results;
• determining patterns for additional testing on the wafer by locating a number of test sites defined in the test plan tat intersect a number of predefined seeded patterns associated with one or more second test maps;
• and
• creating dynamic instances of the one or more second test maps for testing during a same testing session as the first test map by using the located test sites and the first results.

A method for dynamic wafer map creation, comprising:

• executing a first test on a wafer using a first test map;
• identifying test sites on the wafer available for testing;
• matching a number of the test sites with patterns associated with one or more second test maps;
• and
• dynamically executing one or more second tests on the wafer using the one or more second test maps, in response to matching and during a same testing session as the first test.

A dynamic wafer testing system, comprising:

• a lot of wafers subject to a testing session associated with a test plan;
• a first test map associated with the test plan;
• a number of test sites associated with each of the wafers in the lot and identified in the test plan;
• and
• a test station controller that initiates testing of the first test map on a first wafer in the lot, and that acquires the test sites identified in the test plan, and wherein the test station controller dynamically identifies a number of additional test maps associated with patterns of the test sites on the first wafer, and dynamically tests the first wafer and the remaining wafers using the additional test maps identified during the same testing session.

A dynamic wafer testing system, comprising:

• a wafer that is subject to testing;
• a processor instance;
• a sensor instance associated with each test register included within the processor instance;
• and
• wherein during testing of the wafer one of the sensor instances detects a measurement statistic that exceeds a predefined threshold, and based on that event a new wafer test map is dynamically identified and used to continue testing the wafer during a same test session.

A wafer subject to dynamic testing from instructions accessible to a computer-readable medium, where the instructions comprise:

• identifying a test plan associated with testing the wafer;
• identifying test sites on the wafer from the test plan;
• initiating a first test map created from the test plan to begin testing of the wafer;
• and
• dynamically creating one or more second test maps for continued testing of the wafer during a same testing session.