US 7,009,834 B2Granted

Solid electrolytic capacitor, transmission-line device, method of producing the same, and composite electronic component using the same

AssigneeNEC Tokin Corporation

InventorsSatoshi Arai, Sadamu Toita, Yoshihiko Saiki, Naoki Wako, Masahiko Takahashi

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Abstract

A solid electrolytic capacitor includes a package for a capacitor element including an anode lead portion and a cathode portion. The package includes an insulating resin member which is arranged to cover the capacitor element and which includes hole portions formed therethrough. An anode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the anode lead portion through the hole portion. A cathode terminal of the solid electrolytic capacitor includes a metal-plating layer which is placed in the hole portion to be electrically connected to the cathode conducting portion through the hole portion.

Claims40

Dependent claims

A solid electrolytic capacitor comprising:

(i) a solid electrolytic capacitor element comprising:
an anode member which is made of a valve action metal and extends in a longitudinal direction of the element, and which includes an anode portion and an anode lead portion;
a dielectric layer which is made of a metal oxide of the valve action metal and which is formed on a surface of the anode portion;
and
a cathode member comprising a cathode conducting portion formed on a surface of the dielectric layer;
(ii) a package comprising an insulating resin member which covers the capacitor element, and which has hole portions formed therethrough;
(iii) an anode terminal for electrically connecting to an object, said anode terminal comprising a metal-plating layer which is placed in a corresponding one of the hole portions, and said anode terminal being electrically connected to the anode lead portion through the corresponding one of the hole portions;
and
(iv) a cathode terminal for electrically connecting to the object, said cathode terminal comprising a metal-plating layer which is placed in a corresponding one of the hole portions, and said cathode terminal being electrically connected to the cathode conducting portion through the corresponding one of the hole portions;
wherein each of the anode terminal and the cathode terminal comprises an extension area which protrudes from a surface of the insulating resin member and which is electrically connected to the corresponding metal-plating layer in the corresponding hole portion.

7 more elements

A transmission-line type capacitor device comprising:

(i) a transmission-line type solid electrolytic capacitor element comprising:
an anode member which is made of a valve action metal and extends in a longitudinal direction of the capacitor element, and which includes a first anode lead portion, an anode portion, and a second anode lead portion arranged with the anode portion between the first and second anode lead portions;
a dielectric layer which is made of a metal oxide of the valve action metal and which is formed on a surface of the anode portion;
and
a cathode member comprising a cathode conducting portion formed on a surface of the dielectric layer;
(ii) a package comprising an insulating resin member which is arranged to cover the capacitor element, and which has hole portions formed therethrough;
(iii) anode terminals for electrically connecting to an object, said anode terminals comprising metal-plating layers which are respectively placed in corresponding ones of the hole portions, and said anode terminals being electrically connected to one of the first and the second anode lead portions through the corresponding ones of the hole portions;
and
(iv) a cathode terminal for electrically connecting to the object, said cathode terminal comprising a metal-plating layer which is placed in a corresponding one of the hole portions, and said cathode terminal being electrically connected to the cathode conducting portion through the corresponding one of the hole portions;
wherein each of the anode terminals and the cathode terminal comprises an extension area which protrudes from a surface of the insulating resin member and which is electrically connected to the corresponding metal-plating layer in the corresponding hole portion.

7 more elements

A composite electronic component comprising:

at least one semiconductor chip;
and
a solid electrolytic capacitor on which the semiconductor chip is mounted, and which comprises:
(i) a solid electrolytic capacitor element comprising:
an anode member which is made of a valve action metal and extends in a longitudinal direction of the element, and which includes an anode portion and an anode lead portion;
a dielectric layer which is made of a metal oxide of the valve action metal and which is formed on a surface of the anode portion;
and
a cathode member comprising a cathode conducting portion formed on a surface of the dielectric layer;
(ii) a package comprising an insulating resin member which covers the capacitor element, and which has hole portions formed therethrough;
(iii) an anode terminal which comprises a metal-plating layer that is placed in a corresponding one of the hole portions, and which is electrically connected to the anode lead portion through the corresponding one of the hole portions;
and
(iv) a cathode terminal which comprises a metal-plating layer that is placed in a corresponding one of the hole portions, and which is electrically connected to the cathode conducting portion through the corresponding one of the hole portions;
wherein the anode and cathode terminals are provided for electrically connecting to the semiconductor chip, and each of the anode terminal and the cathode terminal comprises an extension area which protrudes from a surface of the insulating resin member and which is electrically connected to the corresponding metal-plating layer in the corresponding hole portion.

10 more elements

A composite electronic component comprising:

at least one semiconductor chip;
and
a transmission-line type solid electrolytic capacitor on which the semiconductor chip is mounted, and which comprises:
(i) a transmission-line type solid electrolytic capacitor element comprising:
an anode member which is made of a valve action metal and extends in a longitudinal direction of the capacitor element, and which includes a first anode lead portion, an anode portion, and a second anode lead portion arranged with the anode portion between the first and second anode lead portions;
a dielectric layer which is made of a metal oxide of the valve action metal and which is formed on a surface of the anode portion;
and
a cathode member comprising a cathode conducting portion formed on a surface of the dielectric layer;
(ii) a package comprising an insulating resin member which is arranged to cover the capacitor element, and which has hole portions formed therethrough;
(iii) anode terminals which comprise metal-plating layers that are respectively placed in corresponding ones of the hole portions, and each of which is electrically connected to one of the first and the anode lead portions through the corresponding one of the hole portions;
and
(iv) a cathode terminal which comprises a metal-plating layer that is placed in a corresponding one of the hole portions, and which is electrically connecting to the cathode conducting portion through the corresponding one of the hole portions;
wherein the anode and cathode terminals are provided for electrically connecting to the semiconductor chip, and each of the anode terminals and the cathode terminal comprises an extension area which protrudes from a surface of the insulating resin member and which is electrically connected to the corresponding metal-plating layer in the corresponding hole portion.

10 more elements

A composite electronic component comprising:

at least one semiconductor chip;
and
a solid electrolytic capacitor on which the semiconductor chip is mounted, and which comprises:
(i) a solid electrolytic capacitor element comprising:
an anode member which is made of a valve action metal and extends in a longitudinal direction of the element, and which includes an anode portion and an anode lead portion;
a dielectric layer which is made of a metal oxide of the valve action metal and which is formed on a surface of the anode portion;
and
a cathode member comprising a cathode conducting portion formed on a surface of the dielectric layer;
(ii) a package comprising an insulating resin member which covers the capacitor element, and which has hole portions formed therethrough;
(iii) an anode terminal which comprises a metal-plating layer that is placed in a corresponding one of the hole portions, and which is electrically connected to the anode lead portion through the corresponding one of the hole portions;
and
(iv) a cathode terminal which comprises a metal-plating layer that is placed in a corresponding one of the hole portions, and which is electrically connected to the cathode conducting portion through the corresponding one of the hole portions;
wherein the anode and cathode terminals are provided for electrically connecting to the semiconductor chip, and each of the anode terminal and the cathode terminal comprises an extension area which protrudes from a surface of the insulating resin member and which is electrically connected to the corresponding metal-plating layer in the corresponding hole portion;
and
wherein the semiconductor chip and the electrolytic capacitor are mounted on an interposer for adjusting an electrode pitch to a substrate.

12 more elements

A composite electronic component comprising:

at least one semiconductor chip;
and
a transmission-line type solid electrolytic capacitor on which the semiconductor chip is mounted, and which comprises:
(i) a transmission-line type solid electrolytic capacitor element comprising:
an anode member which is made of a valve action metal and extends in a longitudinal direction of the capacitor element, and which includes a first anode lead portion, an anode portion, and a second anode lead portion arranged with the anode portion between the first and second anode lead portions;
a dielectric layer which is made of a metal oxide of the valve action metal and which is formed on a surface of the anode portion;
and
a cathode member comprising a cathode conducting portion formed on a surface of the dielectric layer;
(ii) a package comprising an insulating resin member which is arranged to cover the capacitor element, and which has hole portions formed therethrough;
(iii) anode terminals which comprise metal-plating layers that are respectively placed in corresponding ones of the hole portions, and each of which is electrically connected to one of the first and the anode lead portions through the corresponding one of the hole portions;
and
(iv) a cathode terminal which comprises a metal-plating layer that is placed in a corresponding one of the hole portions, and which is electrically connecting to the cathode conducting portion through the corresponding one of the hole portions;
wherein the anode and cathode terminals are provided for electrically connecting to the semiconductor chip, and each of the anode terminals and the cathode terminal comprises an extension area which protrudes from a surface of the insulating resin member and which is electrically connected to the corresponding metal-plating layer in the corresponding hole portion;
and
wherein the semiconductor chip and the transmission-line type solid electrolytic capacitor are mounted on an interposer for adjusting an electrode pitch to a substrate.

12 more elements

Dependencies are inferred from the claim text.