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US 7,009,747 B2Granted
Micro-mirror and a method for fabricating the same
AssigneeSony Corporation
InventorsMasaki Hara, Takuya Makino, Kazuhito Hori, Kazuhiro Hane, Minoru Sasaki
Life of this patent
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Abstract
A micro-mirror for deflecting an incident light is disclosed, wherein the micro-mirror comprises: a mirror section for reflecting an incident light issued from a laser diode; a hinge section including a fixed section and a movable section each having a flat surface; and a drive section having a bi-morph structure made of two or more of materials having different heat expansion coefficient for deflecting said mirror section to change relative angle to said incident light.
Claims2
A method for fabricating the micro-mirror which comprises:
- a mirror section for reflecting an incident light;
- a hinge section including a fixed section and a movable section each having a flat surface;
- a drive means having a bi-morph structure made of two or more materials having different heat expansion coefficient for deflecting said mirror section of a relative angle to said incident light;
- wherein
- said hinge section and the mirror section are integrally constructed by a structured film formed on a semiconductor substrate by utilizing crystal anisotropy of said semiconductor substrate;
- said movable section of the hinge section is formed as to be continuous from said fixed section of the hinge section and is formed so as to construct a bent slanting surface at an extended section of the fixed section of the hinge section;
- comprising the steps of:
- forming a first groove having a first skewed surface at a side wall on a front surface of said semiconductor substrate, and a second groove having a second skewed surface substantially parallel to said first skewed surface of the first groove at a position and opposite to a flat surface section around said first groove on a back surface of said semiconductor substrate;
- forming structure films at said first skewed surface of the first groove and said flat surface section around said first groove;
- forming a first drive film at one surface of said structured film;
- forming said mirror section and said hinge section made of the structured film by removing said semiconductor substrate with etching process after performing a through-hole etching of said semiconductor substrate to make one end of said structured film to be a free end at a bottom section of said first groove;
- forming a second drive film on another surface of the structured film constructing said hinge section;
- forming a metal film on said structured film constructing said mirror section and the hinge section;
- and
- forming a reflection film and an electrode pad for supplying current to said reflection film by selectively etching said metal film.
12 more elements
Dependencies are inferred from the claim text.