Method and apparatus for scanning, stitching, and damping measurements of a double-sided metrology inspection tool

A method for inspecting both sides of a semiconductor wafer, comprising:

• directing light energy toward each side of the semiconductor wafer;
• damping the semiconductor wafer by mounting a substantially rigid element proximate the semiconductor wafer, thereby forming a gap between said substantially rigid element and said semiconductor wafer free of components;
• and
• receiving light energy reflected from the semiconductor wafer.

A system for inspecting a semiconductor wafer, comprising:

• a light emitter emitting light energy toward the semiconductor wafer;
• a substantially rigid damping member positioned proximate the semiconductor wafer, thereby forming a gap free of components between the substantially rigid damping member and the semiconductor wafer;
• and
• a detector for receiving light energy reflected from the semiconductor wafer, wherein said detector is employed in said inspecting of said semiconductor wafer.