Probing method and probing apparatus
AssigneeTokyo Electron Limited
InventorsMasahito Kobayashi, Kazunari Ishii
Life of this patent
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Abstract
Disclosed is a probing method comprising steps of moving a main chuck to align an object of inspection on the main chuck with probes of a probe card located over the main chuck, moving the main chuck toward the probe card, thereby bringing electrodes of the object of inspection into contact with the probes, overdriving the main chuck toward the probe card while measuring a load applied to the object of inspection by contact with the probes and controlling the movement of the main chuck in accordance with the measured load, and inspecting the electrical properties of the object of inspection by means of the probes.
Claims12
A probing method in which an object of inspection mounted on a main chuck is aligned with probes of a probe card located in a position facing the main chuck, the main chuck is relatively brought close to the probe card, electrodes of the object of inspection are brought into contact with the probes, the main chuck is overdriven toward the probe card, and electrical properties of the object of inspection are inspected by means of the probes, the probing method comprising the steps of:
- locating a table having a pressure sensor and attached to the main chuck in a position facing the probes;
- relatively moving the table with respect to the probe card;
- overdriving the table toward the probe card;
- measuring a load applied to the table by the probes by means of the pressure sensor during the overdrive operation;
- and
- controlling the movement of the main chuck in accordance with the measured load.
A probing apparatus comprising:
- a main chuck carrying an object of inspection thereon;
- a polishing mechanism having a polish plate and attached to the main chuck;
- a probe card having a plurality of probes and located in a position facing the main chuck;
- a drive mechanism which moves the main chuck in at least a Z-direction;
- a pressure sensor adapted to measure a load applied to the polish plate of the polishing mechanism attached to the main chuck by the probes, when the drive mechanism moves the main chuck toward the probe card to bring the polish plate into contact with the probes;
- and
- a controller which controls the drive mechanism and which obtains a load applied to a position where the probes contact the main chuck in accordance with the load measured by the pressure sensor.
A probing apparatus comprising:
- a main chuck carrying an object of inspection thereon;
- a table attached to the main chuck;
- a probe card having a plurality of probes and located in a position facing the main chuck;
- a drive mechanism which moves the main chuck in at least a Z-direction;
- a pressure sensor adapted to measure a load applied to the table attached to the main chuck by the probes, when the drive mechanism moves the main chuck toward the probe card to bring the table into contact with the probes;
- and
- a controller which controls the drive mechanism and which obtains a load applied to a position where the probes contact the main chuck in accordance with the load measured by the pressure sensor.
Dependencies are inferred from the claim text.