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US 7,009,413 B1Granted
System and method for testing ball grid arrays
AssigneeQLOGIC, Corporation
InventorMuwaffaq Alghouli
Life of this patent
Estimating the term…
Abstract
An apparatus for testing ball grid arrays (“BGAs”) is provided. The apparatus includes, a socket slot in a printed circuit board for holding a socket used for testing the BGAs; and plural holding members that support BGA solder balls. The socket top may have plural prong like holding members; plural circular holding members; and/or plural spiral holding members for supporting the solder balls. The holding members may be etched on a BGA socket top and are flexible, rigid and/or semi-rigid to provide support for the solder balls.
Claims4
An apparatus for testing ball grid arrays (“BGAs”) comprising:
- a socket slot in a printed circuit board for receiving a socket that is used for supporting BGAs solder balls, wherein the BGA solder balls are supported by plural holding members of the socket;
- and a via through the printed circuit board connects the BGA solder balls to a solder ball at one end of the printed circuit board, wherein the solder ball at the end of the printed circuit board is connected to a testing module used for testing the BGAs.
Dependencies are inferred from the claim text.