Methods and apparatus for improving high frequency input/output performance
OwnerXiaodong Jin, Lawrence Tse +3inventors
InventorsXiaodong Jin, Lawrence Tse, King Chun Tsai, George Chien, Shuran Wei
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Abstract
A circuit that eliminates an off-chip inductive component connected between an integrated circuit (IC) arranged on a package and an external load comprises a package and an IC that is arranged on the package. A first bondwire arranged on the package has one end that communicates with the external load and an opposite end that communicates with the IC. A second bondwire located on the package has one end that communicates with the external load and an opposite end that communicates with the IC.
Claims8
A circuit that eliminates an off-chip inductive component connected between an integrated circuit (IC) arranged on a package and an external load, comprising:
- a package;
- an IC that is arranged on said package;
- a first bondwire arranged on said package having one end that communicates with the external load and an opposite end that communicates with said IC;
- and
- a second bondwire arranged on said package that has one end that communicates with the external load and an opposite end that communicates with said IC.
A circuit that eliminates an off-chip inductive component connected between an integrated circuit (IC) arranged on a package and an external load, comprising:
- a package;
- an IC that is arranged on said package;
- first bondwire means for providing a connection, that is arranged on said package and that has one end that communicates with the external load and an opposite end that communicates with said IC;
- and
- second bondwire means for providing a connection, that is arranged on said package and that has one end that communicates with the external load and an opposite end that communicates with said IC.
A method for eliminating an off-chip inductive component connected between an integrated circuit (IC) arranged on a package and an external load, comprising:
- providing an IC that is arranged on a package;
- arranging a first bondwire on said package with one end communicating with the external load and an opposite end communicating with said IC;
- and
- arranging a second bondwire on said package with one end communicating with the external load and an opposite end communicating with said IC.
Dependencies are inferred from the claim text.