Low stress and warpage laminate flip chip BGA package
AssigneeAltera Corporation
InventorYuan Li
Life of this patent
Estimating the term…
Abstract
Provided are a semiconductor die flip chip package with warpage control and fabrication methods for such packages. The packages include heat spreaders that are attached to the die and packaging substrate. In general, the modulus of the adhesive, which is used to attach the heat spreader to the substrate, is selected to provide a relatively “soft” connection. The result is a package with less bowing and so improved co-planarity (e.g., in compliance with industry specifications) with the surface to which it is ultimately bound. Moreover, the die and package reliabilities are thereby enhanced.
Claims33
A semiconductor device package, comprising:
- a die having a back surface and a front surface;
- a substrate having a die side and a board side;
- and
- a heat spreader coupled to the die side of the substrate with an adhesive, the adhesive having an elastic modulus of not more than about 2 GPa and a Tg between 30° C. and 70° C.
A semiconductor device package, comprising:
- a die having a back surface and a front surface;
- a substrate having a die side and a board side;
- and
- a heat spreader coupled to the die side of the substrate with an adhesive, the adhesive having an elastic modulus of not more than about 2 GPa, wherein the heat spreader is also coupled to the back surface of the die with a thermal interface material, wherein the thermal interface material has a modulus greater than or equal to that of the adhesive.
A semiconductor device package, comprising:
- a die having a back surface and a front surface;
- a substrate having a die side and a board side;
- and
- a heat spreader coupled to the die side of the substrate with an adhesive, the adhesive having an elastic modulus of not more than about 2 GPa, wherein the heat spreader is also coupled to the back surface of the die with a thermal interface material, wherein the thermal interface material has an elastic modulus about 0.4 GPa.
A semiconductor device package, comprising:
- a die having a back surface and a front surface, wherein the die is a low-K Si die;
- a substrate having a die side and a board side;
- and
- a heat spreader coupled to Fe die side of the substrate with an adhesive, the adhesive having an elastic modulus of not more than about 2 GPa.
A semiconductor device package, comprising:
- a die having a back surface and a front surface, wherein the die is at least 19 mils thick;
- a substrate having a die side and a board side;
- and
- a heat spreader coupled to the die side of the substrate with an adhesive, the adhesive having an elastic modulus of not more than about 2 GPa.
A semiconductor device package, comprising:
- a die having a back surface and a front surface, wherein the die is about 29 mils thick;
- a substrate having a die side and a board side;
- and
- a heat spreader coupled to the die side of the substrate with an adhesive, the adhesive having an elastic modulus of not more than about 2 GPa.
A semiconductor device package, comprising:
- a die having a back surface and a front surface, wherein the back surface has a surface area of at least 400 mm2:
- a substrate having a die side and a board side;
- and
- a heat spreader coupled to the die side of the substrate with an adhesive, the adhesive having an elastic modulus of not more than about 2 GPa.
A method of packaging a semiconductor device, comprising:
- providing a die having a back surface and a front surface;
- providing a substrate having a die side and a board side;
- and
- coupling a heat spreader to the die side of the substrate with an adhesive, the adhesive having an elastic modulus of not more than about 2 GPa and a Tg between 30° C. and 70° C.
A method of packaging a semiconductor device, comprising:
- providing a die having a back surface and a front surface;
- providing a substrate having a die side and a board side;
- coupling a heat spreader to the die side of the substrate with an adhesive, the adhesive having an elastic modulus of not more than about 2 GPa;
- and
- coupling the heat spreader to the back surface of the die with a thermal interface material, wherein the thermal interface material has a modulus greater than or equal to that of the adhesive.
A method of packaging a semiconductor device, comprising:
- providing a die having a back surface and a front surface;
- providing a substrate having a die side and a board side;
- coupling a heat spreader to the die side of the substrate with an adhesive, the adhesive having an elastic modulus of not more than about 2 GPa;
- and
- coupling the heat spreader to the back surface of the die with a thermal interface material, wherein the thermal interface material has an elastic modulus about 0.4 GPa.
A method of packaging a semiconductor device, comprising:
- providing a die having a back surface and a front surface, wherein the die is a low-K Si die;
- providing a substrate having a die side and a board side;
- and
- coupling a heat spreader to the die side of the substrate with an adhesive, the adhesive having an elastic modulus of not more than about 2 GPa.
A method of packaging a semiconductor device, comprising:
- providing a die having a back surface and a front surface, wherein the die is at least 19 mils thick;
- providing a substrate having a die side and a board side;
- and
- coupling a heat spreader to the die side of the substrate with an adhesive, the adhesive having an elastic modulus of not more than about 2 GPa.
A method of packaging a semiconductor device, comprising:
- providing a die having a back surface and a front surface, wherein the die is about 29 mils thick;
- providing a substrate having a die side and a board side;
- and
- coupling a heat spreader to the die side of the substrate with an adhesive, the adhesive having an elastic modulus of not more than about 2 GPa.
A method of packaging a semiconductor device, comprising:
- providing a die having a back surface and a front surface, wherein the back surface has a surface area of at least 400 mm2;
- providing a substrate having a die side and a board side;
- and
- coupling a heat spreader to the die side of the substrate with an adhesive, the adhesive having an elastic modulus of not more than about 2 GPa.
A semiconductor device package, comprising:
- a die having a back surface and a front surface;
- a substrate having a die side and a board side;
- and
- means having an elastic modulus of not more than about 2 GPa and a Tg between 30° C. and 70° C. for coupling a heat spreader to the die side of the substrate.
Dependencies are inferred from the claim text.